M1A3P600-FG144Y
vs
M1A3P600-2PQG208I
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Active
Active
Ihs Manufacturer
MICROCHIP TECHNOLOGY INC
MICROCHIP TECHNOLOGY INC
Package Description
13 X 13 MM, 1.45 MM HEIGHT, 1 MM PITCH, FPBGA-144
28 X 28 MM, 3.40 MM HEIGHT, 0.50 MM PITCH, GREEN, PLASTIC, QFP-208
Reach Compliance Code
compliant
compliant
HTS Code
8542.39.00.01
8542.39.00.01
JESD-30 Code
S-PBGA-B144
S-PQFP-G208
JESD-609 Code
e0
e3
Length
13 mm
28 mm
Moisture Sensitivity Level
3
3
Number of CLBs
13824
13824
Number of Equivalent Gates
600000
600000
Number of Inputs
97
154
Number of Outputs
97
154
Number of Terminals
144
208
Operating Temperature-Max
85 °C
100 °C
Operating Temperature-Min
-40 °C
Organization
13824 CLBS, 600000 GATES
13824 CLBS, 600000 GATES
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LBGA
FQFP
Package Equivalence Code
BGA144,12X12,40
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY, LOW PROFILE
FLATPACK, FINE PITCH
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
FIELD PROGRAMMABLE GATE ARRAY
Seated Height-Max
1.55 mm
4.1 mm
Supply Voltage-Max
1.575 V
1.575 V
Supply Voltage-Min
1.425 V
1.425 V
Supply Voltage-Nom
1.5 V
1.5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
INDUSTRIAL
Terminal Finish
TIN LEAD
MATTE TIN
Terminal Form
BALL
GULL WING
Terminal Pitch
1 mm
0.5 mm
Terminal Position
BOTTOM
QUAD
Width
13 mm
28 mm
Base Number Matches
2
2
Factory Lead Time
14 Weeks
Clock Frequency-Max
350 MHz
Packing Method
TRAY
Peak Reflow Temperature (Cel)
245
Qualification Status
Not Qualified
Time@Peak Reflow Temperature-Max (s)
30
Compare M1A3P600-FG144Y with alternatives
Compare M1A3P600-2PQG208I with alternatives