M1A3P600-2FGG256YI
vs
M1A3P600-2FG256I
feature comparison
Part Life Cycle Code |
Transferred
|
Active
|
Ihs Manufacturer |
MICROSEMI SOC PRODUCTS GROUP
|
MICROCHIP TECHNOLOGY INC
|
Part Package Code |
BGA
|
|
Package Description |
LBGA,
|
17 X 17 MM, 1.60 MM HEIGHT, 1 MM PITCH, FBGA-256
|
Pin Count |
256
|
|
Reach Compliance Code |
unknown
|
compliant
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
JESD-30 Code |
S-PBGA-B256
|
S-PBGA-B256
|
JESD-609 Code |
e1
|
e0
|
Length |
17 mm
|
17 mm
|
Moisture Sensitivity Level |
3
|
3
|
Number of CLBs |
13824
|
13824
|
Number of Equivalent Gates |
600000
|
600000
|
Number of Terminals |
256
|
256
|
Operating Temperature-Max |
85 °C
|
100 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Organization |
13824 CLBS, 600000 GATES
|
13824 CLBS, 600000 GATES
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
LBGA
|
BGA
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY, LOW PROFILE
|
GRID ARRAY
|
Peak Reflow Temperature (Cel) |
250
|
|
Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY
|
FIELD PROGRAMMABLE GATE ARRAY
|
Seated Height-Max |
1.7 mm
|
1.8 mm
|
Supply Voltage-Max |
1.575 V
|
1.575 V
|
Supply Voltage-Min |
1.425 V
|
1.425 V
|
Supply Voltage-Nom |
1.5 V
|
1.5 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Finish |
Tin/Silver/Copper (Sn/Ag/Cu)
|
Tin/Lead (Sn/Pb)
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
1 mm
|
1 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Time@Peak Reflow Temperature-Max (s) |
30
|
|
Width |
17 mm
|
17 mm
|
Base Number Matches |
3
|
3
|
Rohs Code |
|
No
|
Factory Lead Time |
|
12 Weeks
|
Packing Method |
|
TRAY
|
Qualification Status |
|
Not Qualified
|
|
|
|
Compare M1A3P600-2FGG256YI with alternatives
Compare M1A3P600-2FG256I with alternatives