M1A3P600-2FG484YI
vs
M1A3P600-PQG208YI
feature comparison
Part Life Cycle Code |
Transferred
|
Obsolete
|
Ihs Manufacturer |
MICROSEMI SOC PRODUCTS GROUP
|
MICROCHIP TECHNOLOGY INC
|
Part Package Code |
BGA
|
|
Package Description |
BGA,
|
28 X 28 MM, 3.40 MM HEIGHT, 0.50 MM PITCH, GREEN, PLASTIC, QFP-208
|
Pin Count |
484
|
|
Reach Compliance Code |
unknown
|
compliant
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
JESD-30 Code |
S-PBGA-B484
|
S-PQFP-G208
|
JESD-609 Code |
e0
|
|
Length |
23 mm
|
28 mm
|
Moisture Sensitivity Level |
3
|
3
|
Number of CLBs |
13824
|
13824
|
Number of Equivalent Gates |
600000
|
600000
|
Number of Terminals |
484
|
208
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Organization |
13824 CLBS, 600000 GATES
|
13824 CLBS, 600000 GATES
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
BGA
|
FQFP
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY
|
FLATPACK, FINE PITCH
|
Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY
|
FIELD PROGRAMMABLE GATE ARRAY
|
Seated Height-Max |
2.44 mm
|
4.1 mm
|
Supply Voltage-Max |
1.575 V
|
1.575 V
|
Supply Voltage-Min |
1.425 V
|
1.425 V
|
Supply Voltage-Nom |
1.5 V
|
1.5 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Finish |
TIN LEAD
|
|
Terminal Form |
BALL
|
GULL WING
|
Terminal Pitch |
1 mm
|
0.5 mm
|
Terminal Position |
BOTTOM
|
QUAD
|
Width |
23 mm
|
28 mm
|
Base Number Matches |
1
|
1
|
Rohs Code |
|
Yes
|
Peak Reflow Temperature (Cel) |
|
245
|
Time@Peak Reflow Temperature-Max (s) |
|
30
|
|
|
|
Compare M1A3P600-2FG484YI with alternatives
Compare M1A3P600-PQG208YI with alternatives