M1A3P600-1FGG256Y
vs
M1A3P600-2FG144IY
feature comparison
| Part Life Cycle Code |
Transferred
|
Active
|
| Ihs Manufacturer |
MICROSEMI SOC PRODUCTS GROUP
|
MICROCHIP TECHNOLOGY INC
|
| Part Package Code |
BGA
|
|
| Package Description |
LBGA,
|
|
| Pin Count |
256
|
|
| Reach Compliance Code |
unknown
|
compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| JESD-30 Code |
S-PBGA-B256
|
|
| JESD-609 Code |
e1
|
|
| Length |
17 mm
|
|
| Moisture Sensitivity Level |
3
|
|
| Number of CLBs |
13824
|
|
| Number of Equivalent Gates |
600000
|
|
| Number of Terminals |
256
|
|
| Operating Temperature-Max |
85 °C
|
|
| Operating Temperature-Min |
|
|
| Organization |
13824 CLBS, 600000 GATES
|
|
| Package Body Material |
PLASTIC/EPOXY
|
|
| Package Code |
LBGA
|
|
| Package Shape |
SQUARE
|
|
| Package Style |
GRID ARRAY, LOW PROFILE
|
|
| Peak Reflow Temperature (Cel) |
250
|
|
| Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY
|
FIELD PROGRAMMABLE GATE ARRAY
|
| Seated Height-Max |
1.7 mm
|
|
| Supply Voltage-Max |
1.575 V
|
|
| Supply Voltage-Min |
1.425 V
|
|
| Supply Voltage-Nom |
1.5 V
|
|
| Surface Mount |
YES
|
|
| Technology |
CMOS
|
|
| Temperature Grade |
COMMERCIAL
|
|
| Terminal Finish |
Tin/Silver/Copper (Sn/Ag/Cu)
|
|
| Terminal Form |
BALL
|
|
| Terminal Pitch |
1 mm
|
|
| Terminal Position |
BOTTOM
|
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Width |
17 mm
|
|
| Base Number Matches |
2
|
1
|
|
|
|
Compare M1A3P600-1FGG256Y with alternatives
Compare M1A3P600-2FG144IY with alternatives