M1A3P600-1FGG144IY
vs
M1A3P600-FGG256
feature comparison
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Active
|
Active
|
Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROCHIP TECHNOLOGY INC
|
Reach Compliance Code |
compliant
|
compliant
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Moisture Sensitivity Level |
3
|
3
|
Peak Reflow Temperature (Cel) |
260
|
250
|
Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY
|
FIELD PROGRAMMABLE GATE ARRAY
|
Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
Base Number Matches |
1
|
6
|
Package Description |
|
17 X 17 MM, 1.60 MM HEIGHT, 1 MM PITCH, GREEN, FBGA-256
|
Factory Lead Time |
|
12 Weeks
|
Clock Frequency-Max |
|
350 MHz
|
JESD-30 Code |
|
S-PBGA-B256
|
JESD-609 Code |
|
e1
|
Length |
|
17 mm
|
Number of CLBs |
|
13824
|
Number of Equivalent Gates |
|
600000
|
Number of Terminals |
|
256
|
Operating Temperature-Max |
|
85 °C
|
Operating Temperature-Min |
|
|
Organization |
|
13824 CLBS, 600000 GATES
|
Package Body Material |
|
PLASTIC/EPOXY
|
Package Code |
|
BGA
|
Package Shape |
|
SQUARE
|
Package Style |
|
GRID ARRAY
|
Packing Method |
|
TRAY
|
Qualification Status |
|
Not Qualified
|
Seated Height-Max |
|
1.8 mm
|
Supply Voltage-Max |
|
1.575 V
|
Supply Voltage-Min |
|
1.425 V
|
Supply Voltage-Nom |
|
1.5 V
|
Surface Mount |
|
YES
|
Technology |
|
CMOS
|
Temperature Grade |
|
COMMERCIAL
|
Terminal Finish |
|
TIN SILVER COPPER
|
Terminal Form |
|
BALL
|
Terminal Pitch |
|
1 mm
|
Terminal Position |
|
BOTTOM
|
Width |
|
17 mm
|
|
|
|
Compare M1A3P600-1FGG144IY with alternatives
Compare M1A3P600-FGG256 with alternatives