M1A3P600-1FG484
vs
M1A3P600-1PQG208IY
feature comparison
| Rohs Code |
No
|
Yes
|
| Part Life Cycle Code |
Transferred
|
Active
|
| Ihs Manufacturer |
MICROSEMI CORP
|
MICROCHIP TECHNOLOGY INC
|
| Package Description |
BGA,
|
|
| Reach Compliance Code |
unknown
|
compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Clock Frequency-Max |
350 MHz
|
|
| JESD-30 Code |
S-PBGA-B484
|
|
| JESD-609 Code |
e0
|
|
| Length |
23 mm
|
|
| Moisture Sensitivity Level |
3
|
3
|
| Number of CLBs |
13824
|
|
| Number of Equivalent Gates |
600000
|
|
| Number of Terminals |
484
|
|
| Operating Temperature-Max |
85 °C
|
|
| Operating Temperature-Min |
|
|
| Organization |
13824 CLBS, 600000 GATES
|
|
| Package Body Material |
PLASTIC/EPOXY
|
|
| Package Code |
BGA
|
|
| Package Shape |
SQUARE
|
|
| Package Style |
GRID ARRAY
|
|
| Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY
|
FIELD PROGRAMMABLE GATE ARRAY
|
| Qualification Status |
Not Qualified
|
|
| Seated Height-Max |
2.44 mm
|
|
| Supply Voltage-Max |
1.575 V
|
|
| Supply Voltage-Min |
1.425 V
|
|
| Supply Voltage-Nom |
1.5 V
|
|
| Surface Mount |
YES
|
|
| Technology |
CMOS
|
|
| Temperature Grade |
COMMERCIAL
|
|
| Terminal Finish |
TIN LEAD
|
|
| Terminal Form |
BALL
|
|
| Terminal Pitch |
1 mm
|
|
| Terminal Position |
BOTTOM
|
|
| Width |
23 mm
|
|
| Base Number Matches |
8
|
1
|
| Peak Reflow Temperature (Cel) |
|
245
|
| Time@Peak Reflow Temperature-Max (s) |
|
30
|
|
|
|
Compare M1A3P600-1FG484 with alternatives
Compare M1A3P600-1PQG208IY with alternatives