M1A3P600-1FG144II
vs
M1A3P600-1FGG144
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Transferred
Active
Ihs Manufacturer
ACTEL CORP
MICROCHIP TECHNOLOGY INC
Package Description
13X 13 MM, 1.45 MM HEIGHT, 1 MM PITCH, FBGA-144
13X 13 MM, 1.45 MM HEIGHT, 1 MM PITCH, GREEN, FBGA-144
Reach Compliance Code
unknown
compliant
Clock Frequency-Max
350 MHz
350 MHz
JESD-30 Code
S-PBGA-B144
S-PBGA-B144
Length
13 mm
13 mm
Number of CLBs
13824
13824
Number of Equivalent Gates
600000
600000
Number of Terminals
144
144
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
Organization
13824 CLBS, 600000 GATES
13824 CLBS, 600000 GATES
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LBGA
LBGA
Package Equivalence Code
BGA144,12X12,40
BGA144,12X12,40
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY, LOW PROFILE
GRID ARRAY, LOW PROFILE
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
FIELD PROGRAMMABLE GATE ARRAY
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.55 mm
1.55 mm
Supply Voltage-Max
1.575 V
1.575 V
Supply Voltage-Min
1.425 V
1.425 V
Supply Voltage-Nom
1.5 V
1.5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
COMMERCIAL
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Width
13 mm
13 mm
Base Number Matches
3
3
Rohs Code
HTS Code
8542.39.00.01
Factory Lead Time
12 Weeks
JESD-609 Code
e1
Moisture Sensitivity Level
3
Number of Inputs
97
Number of Outputs
97
Packing Method
TRAY
Peak Reflow Temperature (Cel)
260
Terminal Finish
TIN SILVER COPPER
Time@Peak Reflow Temperature-Max (s)
30
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