M1A3P400-1FGG144I vs M1A3P400-1FGG256YI feature comparison

M1A3P400-1FGG144I Microchip Technology Inc

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M1A3P400-1FGG256YI Microsemi FPGA & SoC

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Rohs Code Yes
Part Life Cycle Code Active Transferred
Ihs Manufacturer MICROCHIP TECHNOLOGY INC MICROSEMI SOC PRODUCTS GROUP
Package Description 13X 13 MM, 1.45 MM HEIGHT, 1 MM PITCH, GREEN, FBGA-144 LBGA,
Reach Compliance Code compliant unknown
HTS Code 8542.39.00.01 8542.39.00.01
Factory Lead Time 12 Weeks
Clock Frequency-Max 350 MHz
JESD-30 Code S-PBGA-B144 S-PBGA-B256
JESD-609 Code e1 e1
Length 13 mm 17 mm
Moisture Sensitivity Level 3 3
Number of CLBs 9216 9216
Number of Equivalent Gates 400000 400000
Number of Inputs 97
Number of Outputs 97
Number of Terminals 144 256
Operating Temperature-Max 100 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Organization 9216 CLBS, 400000 GATES 9216 CLBS, 400000 GATES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LBGA LBGA
Package Equivalence Code BGA144,12X12,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, LOW PROFILE GRID ARRAY, LOW PROFILE
Packing Method TRAY
Peak Reflow Temperature (Cel) 260 250
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified
Seated Height-Max 1.55 mm 1.7 mm
Supply Voltage-Max 1.575 V 1.575 V
Supply Voltage-Min 1.425 V 1.425 V
Supply Voltage-Nom 1.5 V 1.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish TIN SILVER COPPER Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 30
Width 13 mm 17 mm
Base Number Matches 3 1
Part Package Code BGA
Pin Count 256

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Compare M1A3P400-1FGG256YI with alternatives