M1A3P400-1FGG144I
vs
A3P400-FGG256II
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Active
Active
Ihs Manufacturer
MICROCHIP TECHNOLOGY INC
MICROCHIP TECHNOLOGY INC
Package Description
13X 13 MM, 1.45 MM HEIGHT, 1 MM PITCH, GREEN, FBGA-144
17 X 17 MM, 1.60 MM HEIGHT, 1 MM PITCH, GREEN, FBGA-256
Reach Compliance Code
compliant
compliant
HTS Code
8542.39.00.01
8542.39.00.01
Factory Lead Time
12 Weeks
Clock Frequency-Max
350 MHz
350 MHz
JESD-30 Code
S-PBGA-B144
S-PBGA-B256
JESD-609 Code
e1
Length
13 mm
17 mm
Moisture Sensitivity Level
3
3
Number of CLBs
9216
9216
Number of Equivalent Gates
400000
400000
Number of Inputs
97
178
Number of Outputs
97
178
Number of Terminals
144
256
Operating Temperature-Max
100 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Organization
9216 CLBS, 400000 GATES
9216 CLBS, 400000 GATES
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LBGA
BGA
Package Equivalence Code
BGA144,12X12,40
BGA256,16X16,40
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY, LOW PROFILE
GRID ARRAY
Packing Method
TRAY
Peak Reflow Temperature (Cel)
260
250
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
FIELD PROGRAMMABLE GATE ARRAY
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.55 mm
1.8 mm
Supply Voltage-Max
1.575 V
1.575 V
Supply Voltage-Min
1.425 V
1.425 V
Supply Voltage-Nom
1.5 V
1.5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
TIN SILVER COPPER
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
30
30
Width
13 mm
17 mm
Base Number Matches
3
2
Compare M1A3P400-1FGG144I with alternatives
Compare A3P400-FGG256II with alternatives