M1A3P250-VQ100Y
vs
M1A3P250-FGG144IY
feature comparison
| Part Life Cycle Code |
Transferred
|
Active
|
| Ihs Manufacturer |
MICROSEMI SOC PRODUCTS GROUP
|
MICROCHIP TECHNOLOGY INC
|
| Part Package Code |
QFP
|
|
| Package Description |
TFQFP,
|
|
| Pin Count |
100
|
|
| Reach Compliance Code |
unknown
|
compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| JESD-30 Code |
S-PQFP-G100
|
|
| Length |
14 mm
|
|
| Number of CLBs |
6144
|
|
| Number of Equivalent Gates |
250000
|
|
| Number of Terminals |
100
|
|
| Operating Temperature-Max |
85 °C
|
|
| Operating Temperature-Min |
|
|
| Organization |
6144 CLBS, 250000 GATES
|
|
| Package Body Material |
PLASTIC/EPOXY
|
|
| Package Code |
TFQFP
|
|
| Package Shape |
SQUARE
|
|
| Package Style |
FLATPACK, THIN PROFILE, FINE PITCH
|
|
| Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY
|
FIELD PROGRAMMABLE GATE ARRAY
|
| Seated Height-Max |
1.2 mm
|
|
| Supply Voltage-Max |
1.575 V
|
|
| Supply Voltage-Min |
1.425 V
|
|
| Supply Voltage-Nom |
1.5 V
|
|
| Surface Mount |
YES
|
|
| Technology |
CMOS
|
|
| Temperature Grade |
COMMERCIAL
|
|
| Terminal Form |
GULL WING
|
|
| Terminal Pitch |
0.5 mm
|
|
| Terminal Position |
QUAD
|
|
| Width |
14 mm
|
|
| Base Number Matches |
3
|
2
|
| Rohs Code |
|
Yes
|
| Moisture Sensitivity Level |
|
3
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Time@Peak Reflow Temperature-Max (s) |
|
30
|
|
|
|
Compare M1A3P250-VQ100Y with alternatives
Compare M1A3P250-FGG144IY with alternatives