M1A3P250-VQ100Y vs M1A3P250-FG256YI feature comparison

M1A3P250-VQ100Y Microchip Technology Inc

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M1A3P250-FG256YI Microsemi Corporation

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Rohs Code No
Part Life Cycle Code Active Obsolete
Ihs Manufacturer MICROCHIP TECHNOLOGY INC MICROSEMI CORP
Package Description 14 X 14 MM, 1 MM HEIGHT, 0.50 MM PITCH, VTQFP-100 17 X 17 MM, 1.60 MM HEIGHT, 1 MM PITCH, FPBGA-256
Reach Compliance Code compliant unknown
HTS Code 8542.39.00.01 8542.39.00.01
JESD-30 Code S-PQFP-G100 S-PBGA-B256
Length 14 mm 17 mm
Number of CLBs 6144 6144
Number of Equivalent Gates 250000 250000
Number of Inputs 68
Number of Outputs 68
Number of Terminals 100 256
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C
Organization 6144 CLBS, 250000 GATES 6144 CLBS, 250000 GATES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TFQFP LBGA
Package Shape SQUARE SQUARE
Package Style FLATPACK, THIN PROFILE, FINE PITCH GRID ARRAY, LOW PROFILE
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Seated Height-Max 1.2 mm 1.7 mm
Supply Voltage-Max 1.575 V 1.575 V
Supply Voltage-Min 1.425 V 1.425 V
Supply Voltage-Nom 1.5 V 1.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL INDUSTRIAL
Terminal Form GULL WING BALL
Terminal Pitch 0.5 mm 1 mm
Terminal Position QUAD BOTTOM
Width 14 mm 17 mm
Base Number Matches 2 1

Compare M1A3P250-VQ100Y with alternatives

Compare M1A3P250-FG256YI with alternatives