M1A3P250-VQ100Y
vs
M1A3P250-FG256YI
feature comparison
Rohs Code |
No
|
|
Part Life Cycle Code |
Active
|
Obsolete
|
Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROSEMI CORP
|
Package Description |
14 X 14 MM, 1 MM HEIGHT, 0.50 MM PITCH, VTQFP-100
|
17 X 17 MM, 1.60 MM HEIGHT, 1 MM PITCH, FPBGA-256
|
Reach Compliance Code |
compliant
|
unknown
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
JESD-30 Code |
S-PQFP-G100
|
S-PBGA-B256
|
Length |
14 mm
|
17 mm
|
Number of CLBs |
6144
|
6144
|
Number of Equivalent Gates |
250000
|
250000
|
Number of Inputs |
68
|
|
Number of Outputs |
68
|
|
Number of Terminals |
100
|
256
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
|
-40 °C
|
Organization |
6144 CLBS, 250000 GATES
|
6144 CLBS, 250000 GATES
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
TFQFP
|
LBGA
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
FLATPACK, THIN PROFILE, FINE PITCH
|
GRID ARRAY, LOW PROFILE
|
Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY
|
FIELD PROGRAMMABLE GATE ARRAY
|
Seated Height-Max |
1.2 mm
|
1.7 mm
|
Supply Voltage-Max |
1.575 V
|
1.575 V
|
Supply Voltage-Min |
1.425 V
|
1.425 V
|
Supply Voltage-Nom |
1.5 V
|
1.5 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
COMMERCIAL
|
INDUSTRIAL
|
Terminal Form |
GULL WING
|
BALL
|
Terminal Pitch |
0.5 mm
|
1 mm
|
Terminal Position |
QUAD
|
BOTTOM
|
Width |
14 mm
|
17 mm
|
Base Number Matches |
2
|
1
|
|
|
|
Compare M1A3P250-VQ100Y with alternatives
Compare M1A3P250-FG256YI with alternatives