Findchips: Compare M1A3P250-PQ208 vs M1A3P250-FGG144II

M1A3P250-PQ208 vs M1A3P250-FGG144II feature comparison

Buy Now Datasheet

Buy Now Datasheet

Rohs Code	No	Yes
Part Life Cycle Code	Obsolete	Active
Ihs Manufacturer	MICROSEMI CORP	MICROCHIP TECHNOLOGY INC
Package Description	28 X 28 MM, 3.40 MM HEIGHT, 0.50 MM PITCH, PLASTIC, QFP-208	13X 13 MM, 1.45 MM HEIGHT, 1 MM PITCH, GREEN, FBGA-144
Reach Compliance Code	unknown	compliant
HTS Code	8542.39.00.01	8542.39.00.01
JESD-30 Code	S-PQFP-G208	S-PBGA-B144
JESD-609 Code	e0
Length	28 mm	13 mm
Moisture Sensitivity Level	3	3
Number of CLBs	6144	6144
Number of Equivalent Gates	250000	250000
Number of Inputs	151	97
Number of Outputs	151	97
Number of Terminals	208	144
Operating Temperature-Max	85 °C	85 °C
Operating Temperature-Min		-40 °C
Organization	6144 CLBS, 250000 GATES	6144 CLBS, 250000 GATES
Package Body Material	PLASTIC/EPOXY	PLASTIC/EPOXY
Package Code	FQFP	LBGA
Package Shape	SQUARE	SQUARE
Package Style	FLATPACK, FINE PITCH	GRID ARRAY, LOW PROFILE
Programmable Logic Type	FIELD PROGRAMMABLE GATE ARRAY	FIELD PROGRAMMABLE GATE ARRAY
Qualification Status	Not Qualified	Not Qualified
Seated Height-Max	4.1 mm	1.55 mm
Supply Voltage-Max	1.575 V	1.575 V
Supply Voltage-Min	1.425 V	1.425 V
Supply Voltage-Nom	1.5 V	1.5 V
Surface Mount	YES	YES
Technology	CMOS	CMOS
Temperature Grade	COMMERCIAL	INDUSTRIAL
Terminal Finish	TIN LEAD
Terminal Form	GULL WING	BALL
Terminal Pitch	0.5 mm	1 mm
Terminal Position	QUAD	BOTTOM
Width	28 mm	13 mm
Base Number Matches	7	1
Clock Frequency-Max		350 MHz
Package Equivalence Code		BGA144,12X12,40
Peak Reflow Temperature (Cel)		260
Time@Peak Reflow Temperature-Max (s)		30
	Programmable Logic » Field Programmable Gate Arrays	Programmable Logic » Field Programmable Gate Arrays