M1A3P250-1QNG132I
vs
M1A3P250-2FGG144Y
feature comparison
| Part Life Cycle Code |
Obsolete
|
Active
|
| Ihs Manufacturer |
MICROSEMI CORP
|
MICROCHIP TECHNOLOGY INC
|
| Package Description |
,
|
13 X 13 MM, 1.45 MM HEIGHT, 1 MM PITCH, GREEN, FPBGA-144
|
| Reach Compliance Code |
unknown
|
compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| JESD-30 Code |
S-PBCC-B132
|
S-PBGA-B144
|
| Number of Terminals |
132
|
144
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
CHIP CARRIER
|
GRID ARRAY, LOW PROFILE
|
| Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY
|
FIELD PROGRAMMABLE GATE ARRAY
|
| Qualification Status |
Not Qualified
|
|
| Surface Mount |
YES
|
YES
|
| Terminal Form |
BUTT
|
BALL
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Base Number Matches |
2
|
3
|
| Rohs Code |
|
Yes
|
| JESD-609 Code |
|
e1
|
| Length |
|
13 mm
|
| Moisture Sensitivity Level |
|
3
|
| Number of CLBs |
|
6144
|
| Number of Equivalent Gates |
|
250000
|
| Operating Temperature-Max |
|
85 °C
|
| Operating Temperature-Min |
|
|
| Organization |
|
6144 CLBS, 250000 GATES
|
| Package Code |
|
LBGA
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Seated Height-Max |
|
1.55 mm
|
| Supply Voltage-Max |
|
1.575 V
|
| Supply Voltage-Min |
|
1.425 V
|
| Supply Voltage-Nom |
|
1.5 V
|
| Technology |
|
CMOS
|
| Temperature Grade |
|
COMMERCIAL
|
| Terminal Finish |
|
TIN SILVER COPPER
|
| Terminal Pitch |
|
1 mm
|
| Time@Peak Reflow Temperature-Max (s) |
|
30
|
| Width |
|
13 mm
|
|
|
|
Compare M1A3P250-1QNG132I with alternatives
Compare M1A3P250-2FGG144Y with alternatives