M1A3P250-1FGG144
vs
M1A3P250-2QN132
feature comparison
Rohs Code |
Yes
|
|
Part Life Cycle Code |
Transferred
|
Transferred
|
Ihs Manufacturer |
MICROSEMI CORP
|
MICROSEMI CORP
|
Package Description |
LBGA,
|
8 X 8 MM, 0.75 MM HEIGHT, 0.50 MM PITCH, QFN-132
|
Reach Compliance Code |
compliant
|
unknown
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Clock Frequency-Max |
350 MHz
|
|
JESD-30 Code |
S-PBGA-B144
|
S-PBCC-B132
|
JESD-609 Code |
e1
|
|
Length |
13 mm
|
|
Moisture Sensitivity Level |
3
|
|
Number of CLBs |
6144
|
|
Number of Equivalent Gates |
250000
|
|
Number of Terminals |
144
|
132
|
Operating Temperature-Max |
85 °C
|
|
Operating Temperature-Min |
|
|
Organization |
6144 CLBS, 250000 GATES
|
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
LBGA
|
|
Package Equivalence Code |
BGA144,12X12,40
|
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY, LOW PROFILE
|
CHIP CARRIER
|
Peak Reflow Temperature (Cel) |
260
|
|
Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY
|
FIELD PROGRAMMABLE GATE ARRAY
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
1.55 mm
|
|
Supply Voltage-Max |
1.575 V
|
|
Supply Voltage-Min |
1.425 V
|
|
Supply Voltage-Nom |
1.5 V
|
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
|
Temperature Grade |
COMMERCIAL
|
|
Terminal Finish |
TIN SILVER COPPER
|
|
Terminal Form |
BALL
|
BUTT
|
Terminal Pitch |
1 mm
|
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Time@Peak Reflow Temperature-Max (s) |
30
|
|
Width |
13 mm
|
|
Base Number Matches |
8
|
5
|
|
|
|
Compare M1A3P250-1FGG144 with alternatives
Compare M1A3P250-2QN132 with alternatives