M1A3P1000-2FGG144 vs M1A3P1000-1FGG484II feature comparison

M1A3P1000-2FGG144 Microchip Technology Inc

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M1A3P1000-1FGG484II Microchip Technology Inc

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Rohs Code Yes Yes
Part Life Cycle Code Active Active
Ihs Manufacturer MICROCHIP TECHNOLOGY INC MICROCHIP TECHNOLOGY INC
Package Description 13X 13 MM, 1.45 MM HEIGHT, 1 MM PITCH, GREEN, FBGA-144 23 X 23 MM, 2.23 MM HEIGHT, 1 MM PITCH, GREEN, FBGA-484
Reach Compliance Code compliant compliant
HTS Code 8542.39.00.01 8542.39.00.01
Clock Frequency-Max 350 MHz 350 MHz
JESD-30 Code S-PBGA-B144 S-PBGA-B484
JESD-609 Code e1
Length 13 mm 23 mm
Moisture Sensitivity Level 3 3
Number of CLBs 24576 24576
Number of Equivalent Gates 1000000 1000000
Number of Inputs 97 300
Number of Outputs 97 300
Number of Terminals 144 484
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C
Organization 24576 CLBS, 1000000 GATES 24576 CLBS, 1000000 GATES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LBGA BGA
Package Equivalence Code BGA144,12X12,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, LOW PROFILE GRID ARRAY
Packing Method TRAY
Peak Reflow Temperature (Cel) 260 250
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.55 mm 2.44 mm
Supply Voltage-Max 1.575 V 1.575 V
Supply Voltage-Min 1.425 V 1.425 V
Supply Voltage-Nom 1.5 V 1.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL INDUSTRIAL
Terminal Finish TIN SILVER COPPER
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 30
Width 13 mm 23 mm
Base Number Matches 6 1

Compare M1A3P1000-2FGG144 with alternatives

Compare M1A3P1000-1FGG484II with alternatives