M1A3P1000-1FG484II
vs
M1A3P1000-1FGG484IY
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Transferred
Active
Ihs Manufacturer
MICROSEMI CORP
MICROCHIP TECHNOLOGY INC
Package Description
BGA,
Reach Compliance Code
compliant
compliant
HTS Code
8542.39.00.01
8542.39.00.01
Clock Frequency-Max
350 MHz
JESD-30 Code
S-PBGA-B484
Length
23 mm
Number of CLBs
24576
Number of Equivalent Gates
1000000
Number of Terminals
484
Operating Temperature-Max
85 °C
Operating Temperature-Min
-40 °C
Organization
24576 CLBS, 1000000 GATES
Package Body Material
PLASTIC/EPOXY
Package Code
BGA
Package Shape
SQUARE
Package Style
GRID ARRAY
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
FIELD PROGRAMMABLE GATE ARRAY
Qualification Status
Not Qualified
Seated Height-Max
2.44 mm
Supply Voltage-Max
1.575 V
Supply Voltage-Min
1.425 V
Supply Voltage-Nom
1.5 V
Surface Mount
YES
Technology
CMOS
Temperature Grade
INDUSTRIAL
Terminal Form
BALL
Terminal Pitch
1 mm
Terminal Position
BOTTOM
Width
23 mm
Base Number Matches
1
1
Rohs Code
Moisture Sensitivity Level
3
Peak Reflow Temperature (Cel)
250
Time@Peak Reflow Temperature-Max (s)
30
Compare M1A3P1000-1FG484II with alternatives
Compare M1A3P1000-1FGG484IY with alternatives