M12L64164A-5BVAG2Y
vs
W9864G6JB-6
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Active
Not Recommended
Ihs Manufacturer
ELITE SEMICONDUCTOR MEMORY TECHNOLOGY INC
WINBOND ELECTRONICS CORP
Package Description
VFBGA,
TFBGA,
Reach Compliance Code
unknown
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.02
8542.32.00.02
Access Mode
FOUR BANK PAGE BURST
FOUR BANK PAGE BURST
Access Time-Max
5 ns
5 ns
Additional Feature
AUTO REFRESH
AUTO/SELF REFRESH
JESD-30 Code
S-PBGA-B54
R-PBGA-B60
Length
8 mm
10.1 mm
Memory Density
67108864 bit
67108864 bit
Memory IC Type
SYNCHRONOUS DRAM
SYNCHRONOUS DRAM
Memory Width
16
16
Number of Functions
1
1
Number of Ports
1
1
Number of Terminals
54
60
Number of Words
4194304 words
4194304 words
Number of Words Code
4000000
4000000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
105 °C
70 °C
Operating Temperature-Min
-40 °C
Organization
4MX16
4MX16
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
VFBGA
TFBGA
Package Shape
SQUARE
RECTANGULAR
Package Style
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
GRID ARRAY, THIN PROFILE, FINE PITCH
Seated Height-Max
1 mm
1.1 mm
Supply Voltage-Max (Vsup)
3.6 V
3.6 V
Supply Voltage-Min (Vsup)
3 V
3 V
Supply Voltage-Nom (Vsup)
3.3 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
COMMERCIAL
Terminal Form
BALL
BALL
Terminal Pitch
0.8 mm
0.65 mm
Terminal Position
BOTTOM
BOTTOM
Width
8 mm
6.4 mm
Base Number Matches
1
1
Rohs Code
Part Package Code
BGA
Pin Count
60
Samacsys Manufacturer
Winbond
Clock Frequency-Max (fCLK)
166 MHz
I/O Type
COMMON
Interleaved Burst Length
1,2,4,8
Output Characteristics
3-STATE
Package Equivalence Code
BGA60,7X15,25
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Refresh Cycles
4096
Self Refresh
YES
Sequential Burst Length
1,2,4,8,FP
Standby Current-Max
0.002 A
Supply Current-Max
0.075 mA
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Compare M12L64164A-5BVAG2Y with alternatives
Compare W9864G6JB-6 with alternatives