M12L64164A-5BVAG2Y vs W9864G6JB-6 feature comparison

M12L64164A-5BVAG2Y Elite Semiconductor Memory Technology Inc

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W9864G6JB-6 Winbond Electronics Corp

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Part Life Cycle Code Active Not Recommended
Ihs Manufacturer ELITE SEMICONDUCTOR MEMORY TECHNOLOGY INC WINBOND ELECTRONICS CORP
Package Description VFBGA, TFBGA,
Reach Compliance Code unknown compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.02 8542.32.00.02
Access Mode FOUR BANK PAGE BURST FOUR BANK PAGE BURST
Access Time-Max 5 ns 5 ns
Additional Feature AUTO REFRESH AUTO/SELF REFRESH
JESD-30 Code S-PBGA-B54 R-PBGA-B60
Length 8 mm 10.1 mm
Memory Density 67108864 bit 67108864 bit
Memory IC Type SYNCHRONOUS DRAM SYNCHRONOUS DRAM
Memory Width 16 16
Number of Functions 1 1
Number of Ports 1 1
Number of Terminals 54 60
Number of Words 4194304 words 4194304 words
Number of Words Code 4000000 4000000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 105 °C 70 °C
Operating Temperature-Min -40 °C
Organization 4MX16 4MX16
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code VFBGA TFBGA
Package Shape SQUARE RECTANGULAR
Package Style GRID ARRAY, VERY THIN PROFILE, FINE PITCH GRID ARRAY, THIN PROFILE, FINE PITCH
Seated Height-Max 1 mm 1.1 mm
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 3 V 3 V
Supply Voltage-Nom (Vsup) 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL COMMERCIAL
Terminal Form BALL BALL
Terminal Pitch 0.8 mm 0.65 mm
Terminal Position BOTTOM BOTTOM
Width 8 mm 6.4 mm
Base Number Matches 1 1
Rohs Code Yes
Part Package Code BGA
Pin Count 60
Samacsys Manufacturer Winbond
Clock Frequency-Max (fCLK) 166 MHz
I/O Type COMMON
Interleaved Burst Length 1,2,4,8
Output Characteristics 3-STATE
Package Equivalence Code BGA60,7X15,25
Peak Reflow Temperature (Cel) NOT SPECIFIED
Refresh Cycles 4096
Self Refresh YES
Sequential Burst Length 1,2,4,8,FP
Standby Current-Max 0.002 A
Supply Current-Max 0.075 mA
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

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