LXMG1618-12-62
vs
LXM1618-05-21
feature comparison
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
MICROSEMI CORP
|
MICROSEMI CORP
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Analog IC - Other Type |
ANALOG CIRCUIT
|
ANALOG CIRCUIT
|
| Base Number Matches |
1
|
1
|
| Rohs Code |
|
No
|
| Package Description |
|
Module
|
| JESD-30 Code |
|
R-XXMA-X
|
| Number of Functions |
|
1
|
| Operating Temperature-Max |
|
70 °C
|
| Operating Temperature-Min |
|
-20 °C
|
| Package Body Material |
|
UNSPECIFIED
|
| Package Shape |
|
RECTANGULAR
|
| Package Style |
|
MICROELECTRONIC ASSEMBLY
|
| Peak Reflow Temperature (Cel) |
|
NOT SPECIFIED
|
| Qualification Status |
|
Not Qualified
|
| Supply Voltage-Max (Vsup) |
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
|
4.5 V
|
| Supply Voltage-Nom (Vsup) |
|
5 V
|
| Surface Mount |
|
NO
|
| Temperature Grade |
|
OTHER
|
| Terminal Form |
|
UNSPECIFIED
|
| Terminal Position |
|
UNSPECIFIED
|
| Time@Peak Reflow Temperature-Max (s) |
|
NOT SPECIFIED
|
|
|
|
Compare LXMG1618-12-62 with alternatives
Compare LXM1618-05-21 with alternatives