LXM1618-12-63
vs
LXM1618-05-63
feature comparison
All Stats
Differences Only
Rohs Code
No
No
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
MICROSEMI CORP
MICROSEMI CORP
Package Description
Module
Module
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Analog IC - Other Type
ANALOG CIRCUIT
ANALOG CIRCUIT
JESD-30 Code
R-XXMA-X
R-XXMA-X
Number of Functions
1
1
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
-20 °C
-20 °C
Package Body Material
UNSPECIFIED
UNSPECIFIED
Package Code
XMA
XMA
Package Equivalence Code
MODULE(UNSPEC)
MODULE(UNSPEC)
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
MICROELECTRONIC ASSEMBLY
MICROELECTRONIC ASSEMBLY
Peak Reflow Temperature (Cel)
NOT SPECIFIED
NOT SPECIFIED
Qualification Status
Not Qualified
Not Qualified
Supply Voltage-Max (Vsup)
13.8 V
5.5 V
Supply Voltage-Min (Vsup)
10.2 V
4.5 V
Supply Voltage-Nom (Vsup)
12 V
5 V
Surface Mount
NO
NO
Temperature Grade
OTHER
OTHER
Terminal Form
UNSPECIFIED
UNSPECIFIED
Terminal Position
UNSPECIFIED
UNSPECIFIED
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
NOT SPECIFIED
Base Number Matches
1
1
Compare LXM1618-12-63 with alternatives
Compare LXM1618-05-63 with alternatives