LXM1618-12-63 vs LXM1618-05-63 feature comparison

LXM1618-12-63 Microsemi Corporation

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LXM1618-05-63 Microsemi Corporation

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Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer MICROSEMI CORP MICROSEMI CORP
Package Description Module Module
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Analog IC - Other Type ANALOG CIRCUIT ANALOG CIRCUIT
JESD-30 Code R-XXMA-X R-XXMA-X
Number of Functions 1 1
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min -20 °C -20 °C
Package Body Material UNSPECIFIED UNSPECIFIED
Package Code XMA XMA
Package Equivalence Code MODULE(UNSPEC) MODULE(UNSPEC)
Package Shape RECTANGULAR RECTANGULAR
Package Style MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY
Peak Reflow Temperature (Cel) NOT SPECIFIED NOT SPECIFIED
Qualification Status Not Qualified Not Qualified
Supply Voltage-Max (Vsup) 13.8 V 5.5 V
Supply Voltage-Min (Vsup) 10.2 V 4.5 V
Supply Voltage-Nom (Vsup) 12 V 5 V
Surface Mount NO NO
Temperature Grade OTHER OTHER
Terminal Form UNSPECIFIED UNSPECIFIED
Terminal Position UNSPECIFIED UNSPECIFIED
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED NOT SPECIFIED
Base Number Matches 1 1

Compare LXM1618-12-63 with alternatives

Compare LXM1618-05-63 with alternatives