LXM1618-03-22
vs
LXM1617-12-62
feature comparison
Rohs Code |
No
|
No
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
MICROSEMI CORP
|
MICROSEMI CORP
|
Package Description |
Module
|
Module
|
Reach Compliance Code |
unknown
|
unknown
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Analog IC - Other Type |
ANALOG CIRCUIT
|
ANALOG CIRCUIT
|
JESD-30 Code |
R-XXMA-X
|
R-XXMA-X
|
Number of Functions |
1
|
1
|
Operating Temperature-Max |
70 °C
|
70 °C
|
Operating Temperature-Min |
-20 °C
|
-20 °C
|
Package Body Material |
UNSPECIFIED
|
UNSPECIFIED
|
Package Code |
XMA
|
XMA
|
Package Equivalence Code |
MODULE(UNSPEC)
|
MODULE(UNSPEC)
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
MICROELECTRONIC ASSEMBLY
|
MICROELECTRONIC ASSEMBLY
|
Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
NOT SPECIFIED
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Supply Voltage-Max (Vsup) |
3.6 V
|
13.8 V
|
Supply Voltage-Min (Vsup) |
3 V
|
10.2 V
|
Supply Voltage-Nom (Vsup) |
3.3 V
|
12 V
|
Surface Mount |
NO
|
NO
|
Temperature Grade |
OTHER
|
OTHER
|
Terminal Form |
UNSPECIFIED
|
UNSPECIFIED
|
Terminal Position |
UNSPECIFIED
|
UNSPECIFIED
|
Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
NOT SPECIFIED
|
Base Number Matches |
1
|
1
|
|
|
|
Compare LXM1618-03-22 with alternatives
Compare LXM1617-12-62 with alternatives