LTC6421CUDC-20#PBF
vs
LTC6421IUDC-20#TRPBF
feature comparison
Pbfree Code |
No
|
No
|
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
End Of Life
|
End Of Life
|
Ihs Manufacturer |
ANALOG DEVICES INC
|
ANALOG DEVICES INC
|
Package Description |
3 X 4 MM, 0.75 MM HEIGHT, LEAD FREE, PLASTIC, QFN-20
|
3 X 4 MM, 0.75 MM HEIGHT, LEAD FREE, PLASTIC, QFN-20
|
Pin Count |
20
|
20
|
Manufacturer Package Code |
05-08-1742
|
05-08-1742
|
Reach Compliance Code |
compliant
|
compliant
|
Samacsys Manufacturer |
Analog Devices
|
Analog Devices
|
Amplifier Type |
OPERATIONAL AMPLIFIER
|
OPERATIONAL AMPLIFIER
|
Common-mode Reject Ratio-Nom |
68 dB
|
68 dB
|
Input Offset Voltage-Max |
2000 µV
|
2000 µV
|
JESD-30 Code |
R-PQCC-N20
|
R-PQCC-N20
|
JESD-609 Code |
e3
|
e3
|
Length |
4 mm
|
4 mm
|
Moisture Sensitivity Level |
1
|
1
|
Number of Functions |
2
|
2
|
Number of Terminals |
20
|
20
|
Operating Temperature-Max |
70 °C
|
85 °C
|
Operating Temperature-Min |
|
-40 °C
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
HVQCCN
|
HVQCCN
|
Package Equivalence Code |
LCC20,.12X.16,20
|
LCC20,.12X.16,20
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
Peak Reflow Temperature (Cel) |
260
|
260
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
0.8 mm
|
0.8 mm
|
Slew Rate-Nom |
4500 V/us
|
4500 V/us
|
Supply Voltage Limit-Max |
3.6 V
|
3.6 V
|
Supply Voltage-Nom (Vsup) |
3 V
|
3 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
COMMERCIAL
|
INDUSTRIAL
|
Terminal Finish |
Matte Tin (Sn)
|
Matte Tin (Sn)
|
Terminal Form |
NO LEAD
|
NO LEAD
|
Terminal Pitch |
0.5 mm
|
0.5 mm
|
Terminal Position |
QUAD
|
QUAD
|
Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
Width |
3 mm
|
3 mm
|
Base Number Matches |
1
|
1
|
Packing Method |
|
TR
|
|
|
|
Compare LTC6421CUDC-20#PBF with alternatives
Compare LTC6421IUDC-20#TRPBF with alternatives