LTC6253CDC#TRPBF
vs
LTC6253CDC#TRMPBF
feature comparison
Pbfree Code |
No
|
No
|
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
End Of Life
|
End Of Life
|
Ihs Manufacturer |
ANALOG DEVICES INC
|
ANALOG DEVICES INC
|
Package Description |
2 X 2 MM, LEAD FREE, PLASTIC, DFN-8
|
2 X 2 MM, LEAD FREE, PLASTIC, DFN-8
|
Pin Count |
8
|
8
|
Manufacturer Package Code |
05-08-1719
|
05-08-1719
|
Reach Compliance Code |
compliant
|
compliant
|
Samacsys Manufacturer |
Analog Devices
|
Analog Devices
|
Amplifier Type |
OPERATIONAL AMPLIFIER
|
OPERATIONAL AMPLIFIER
|
Average Bias Current-Max (IIB) |
0.7 µA
|
0.7 µA
|
Common-mode Reject Ratio-Nom |
105 dB
|
105 dB
|
Input Offset Voltage-Max |
1400 µV
|
1400 µV
|
JESD-30 Code |
S-PDSO-N8
|
S-PDSO-N8
|
JESD-609 Code |
e3
|
e3
|
Length |
2 mm
|
2 mm
|
Moisture Sensitivity Level |
1
|
1
|
Number of Functions |
2
|
2
|
Number of Terminals |
8
|
8
|
Operating Temperature-Max |
70 °C
|
70 °C
|
Operating Temperature-Min |
|
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
HVSON
|
HVSON
|
Package Equivalence Code |
SOLCC8,.08,18
|
SOLCC8,.08,18
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
|
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
|
Packing Method |
TR
|
TR
|
Peak Reflow Temperature (Cel) |
260
|
260
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
0.8 mm
|
0.8 mm
|
Slew Rate-Nom |
170 V/us
|
170 V/us
|
Supply Voltage Limit-Max |
5.5 V
|
5.5 V
|
Supply Voltage-Nom (Vsup) |
2.7 V
|
2.7 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
Terminal Finish |
Matte Tin (Sn)
|
Matte Tin (Sn)
|
Terminal Form |
NO LEAD
|
NO LEAD
|
Terminal Pitch |
0.45 mm
|
0.45 mm
|
Terminal Position |
DUAL
|
DUAL
|
Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
Unity Gain BW-Nom |
630000
|
630000
|
Width |
2 mm
|
2 mm
|
Base Number Matches |
1
|
1
|
|
|
|
Compare LTC6253CDC#TRPBF with alternatives
Compare LTC6253CDC#TRMPBF with alternatives