LTC6242HVCGN#TRPBF
vs
MCP609T-I/P
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Active
Ihs Manufacturer
LINEAR TECHNOLOGY CORP
MICROCHIP TECHNOLOGY INC
Part Package Code
SSOP
DIP
Package Description
0.150 INCH, LEAD FREE, PLASTIC, SSOP-16
DIP,
Pin Count
16
14
Manufacturer Package Code
GN
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.33.00.01
8542.33.00.01
Amplifier Type
OPERATIONAL AMPLIFIER
OPERATIONAL AMPLIFIER
Architecture
VOLTAGE-FEEDBACK
Average Bias Current-Max (IIB)
0.000075 µA
0.00008 µA
Common-mode Reject Ratio-Nom
105 dB
91 dB
Frequency Compensation
YES
Input Offset Voltage-Max
275 µV
250 µV
JESD-30 Code
R-PDSO-G16
R-PDIP-T14
JESD-609 Code
e3
e3
Length
4.9 mm
19.05 mm
Low-Bias
YES
Low-Offset
YES
Micropower
NO
Moisture Sensitivity Level
1
Neg Supply Voltage Limit-Max
-6 V
Neg Supply Voltage-Nom (Vsup)
-5 V
Number of Functions
4
4
Number of Terminals
16
14
Operating Temperature-Max
70 °C
85 °C
Operating Temperature-Min
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
SSOP
DIP
Package Equivalence Code
SSOP16,.25
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, SHRINK PITCH
IN-LINE
Packing Method
TAPE AND REEL
Peak Reflow Temperature (Cel)
260
Power
NO
Programmable Power
NO
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.75 mm
4.32 mm
Slew Rate-Min
5 V/us
Slew Rate-Nom
10 V/us
0.08 V/us
Supply Current-Max
13.2 mA
Supply Voltage Limit-Max
6 V
7 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
NO
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
INDUSTRIAL
Terminal Finish
Matte Tin (Sn)
MATTE TIN
Terminal Form
GULL WING
THROUGH-HOLE
Terminal Pitch
0.635 mm
2.54 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
30
Unity Gain BW-Nom
18000
155
Voltage Gain-Min
60000
Wideband
NO
Width
3.9 mm
7.62 mm
Base Number Matches
2
2
Pbfree Code
Compare LTC6242HVCGN#TRPBF with alternatives
Compare MCP609T-I/P with alternatives