LTC6087HDD#TRPBF
vs
LTC6087HDD
feature comparison
| Pbfree Code |
No
|
|
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
ANALOG DEVICES INC
|
ANALOG DEVICES INC
|
| Package Description |
DFN-10
|
3 X 3 MM, PLASTIC, MO-229WEED-2, DFN-10
|
| Pin Count |
10
|
|
| Manufacturer Package Code |
05-08-1699
|
|
| Reach Compliance Code |
compliant
|
not_compliant
|
| Samacsys Manufacturer |
Analog Devices
|
|
| Amplifier Type |
OPERATIONAL AMPLIFIER
|
OPERATIONAL AMPLIFIER
|
| Average Bias Current-Max (IIB) |
0.0005 µA
|
0.0005 µA
|
| Common-mode Reject Ratio-Nom |
80 dB
|
80 dB
|
| Input Offset Voltage-Max |
1600 µV
|
1600 µV
|
| JESD-30 Code |
S-PDSO-N10
|
S-PDSO-N10
|
| JESD-609 Code |
e3
|
e0
|
| Length |
3 mm
|
3 mm
|
| Moisture Sensitivity Level |
1
|
1
|
| Number of Functions |
2
|
2
|
| Number of Terminals |
10
|
10
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
HVSON
|
HVSON
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
|
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
|
| Packing Method |
TR
|
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Qualification Status |
Not Qualified
|
|
| Seated Height-Max |
0.8 mm
|
0.8 mm
|
| Slew Rate-Nom |
7.2 V/us
|
7.2 V/us
|
| Supply Voltage Limit-Max |
6 V
|
6 V
|
| Supply Voltage-Nom (Vsup) |
3 V
|
3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
AUTOMOTIVE
|
AUTOMOTIVE
|
| Terminal Finish |
Matte Tin (Sn)
|
Tin/Lead (Sn/Pb)
|
| Terminal Form |
NO LEAD
|
NO LEAD
|
| Terminal Pitch |
0.5 mm
|
0.5 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Unity Gain BW-Nom |
14000
|
14000
|
| Width |
3 mm
|
3 mm
|
| Base Number Matches |
1
|
4
|
| ECCN Code |
|
EAR99
|
| HTS Code |
|
8542.33.00.01
|
|
|
|
Compare LTC6087HDD#TRPBF with alternatives
Compare LTC6087HDD with alternatives