LTC4415EMSE#PBF
vs
LTC4415EDHC#PBF
feature comparison
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Transferred
|
Transferred
|
Ihs Manufacturer |
LINEAR TECHNOLOGY CORP
|
LINEAR TECHNOLOGY CORP
|
Part Package Code |
MSOP
|
DFN
|
Package Description |
LEAD FREE, PLASTIC, MSOP-16
|
5 X 3 MM, LEAD FREE, PLASTIC, MO-229WJED-1, DFN-16
|
Pin Count |
16
|
16
|
Manufacturer Package Code |
MSE
|
DHC
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Adjustable Threshold |
YES
|
YES
|
Analog IC - Other Type |
POWER SUPPLY SUPPORT CIRCUIT
|
POWER SUPPLY SUPPORT CIRCUIT
|
JESD-30 Code |
R-PDSO-G16
|
R-PDSO-N16
|
JESD-609 Code |
e3
|
e3
|
Length |
4.039 mm
|
5 mm
|
Moisture Sensitivity Level |
1
|
1
|
Number of Channels |
2
|
2
|
Number of Functions |
2
|
2
|
Number of Terminals |
16
|
16
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
|
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
HTSSOP
|
HVSON
|
Package Equivalence Code |
TSSOP16,.19,20
|
SOLCC16,.12,20
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH
|
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
|
Peak Reflow Temperature (Cel) |
260
|
260
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
1.1 mm
|
0.8 mm
|
Supply Current-Max (Isup) |
0.08 mA
|
0.08 mA
|
Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
Supply Voltage-Min (Vsup) |
1.7 V
|
1.7 V
|
Supply Voltage-Nom (Vsup) |
3.6 V
|
3.6 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
OTHER
|
OTHER
|
Terminal Finish |
MATTE TIN
|
MATTE TIN
|
Terminal Form |
GULL WING
|
NO LEAD
|
Terminal Pitch |
0.5 mm
|
0.5 mm
|
Terminal Position |
DUAL
|
DUAL
|
Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
Width |
3 mm
|
3 mm
|
Base Number Matches |
1
|
1
|
|
|
|
Compare LTC4415EMSE#PBF with alternatives
Compare LTC4415EDHC#PBF with alternatives