LTC3350IUHF#PBF
vs
LTC3350EUHF#PBF
feature comparison
| Pbfree Code |
No
|
No
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
ANALOG DEVICES INC
|
ANALOG DEVICES INC
|
| Package Description |
QFN-38
|
QFN-38
|
| Pin Count |
38
|
38
|
| Manufacturer Package Code |
05-08-1701
|
05-08-1701
|
| Reach Compliance Code |
compliant
|
compliant
|
| Samacsys Manufacturer |
Analog Devices
|
Analog Devices
|
| Adjustable Threshold |
YES
|
YES
|
| Analog IC - Other Type |
POWER SUPPLY SUPPORT CIRCUIT
|
POWER SUPPLY SUPPORT CIRCUIT
|
| JESD-30 Code |
R-PQCC-N38
|
R-PQCC-N38
|
| JESD-609 Code |
e3
|
e3
|
| Length |
7 mm
|
7 mm
|
| Moisture Sensitivity Level |
1
|
1
|
| Number of Channels |
1
|
1
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
38
|
38
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
HVQCCN
|
HVQCCN
|
| Package Equivalence Code |
LCC38,.2X.28,20
|
LCC38,.2X.28,20
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Seated Height-Max |
0.8 mm
|
0.8 mm
|
| Supply Voltage-Max (Vsup) |
35 V
|
35 V
|
| Supply Voltage-Min (Vsup) |
4.5 V
|
4.5 V
|
| Supply Voltage-Nom (Vsup) |
12 V
|
12 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Terminal Finish |
Matte Tin (Sn)
|
Matte Tin (Sn) - annealed
|
| Terminal Form |
NO LEAD
|
NO LEAD
|
| Terminal Pitch |
0.5 mm
|
0.5 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Threshold Voltage-Nom |
+1.3V
|
+1.3V
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
| Width |
5 mm
|
5 mm
|
| Base Number Matches |
1
|
1
|
|
|
|
Compare LTC3350IUHF#PBF with alternatives
Compare LTC3350EUHF#PBF with alternatives