LTC3129EUD-1#TRPBF
vs
LTC3129IMSE-1#PBF
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
LINEAR TECHNOLOGY CORP
LINEAR TECHNOLOGY CORP
Part Package Code
QFN
MSOP
Package Description
3 X 3 MM, LEAD FREE, PLASTIC, MO-220WEED-4, QFN-16
LEAD FREE, PLASTIC, MSOP-16
Pin Count
16
16
Manufacturer Package Code
UD
MSE
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.39.00.01
8542.39.00.01
Additional Feature
OUTPUT 3.3, 4.1, 5, 6.9, 8.2, 12. 15 VOLTS ARE AVAILABLE; CURRENT MODE IS ALSO AVAILABLE
OUTPUT 3.3, 4.1, 5, 6.9, 8.2, 12. 15 VOLTS ARE AVAILABLE; CURRENT MODE IS ALSO AVAILABLE
Analog IC - Other Type
SWITCHING REGULATOR
SWITCHING REGULATOR
Control Mode
CURRENT-MODE
CURRENT-MODE
Control Technique
PULSE WIDTH MODULATION
PULSE WIDTH MODULATION
Input Voltage-Max
15 V
15 V
Input Voltage-Min
1.92 V
1.92 V
Input Voltage-Nom
12 V
12 V
JESD-30 Code
S-PQCC-N16
R-PDSO-G16
JESD-609 Code
e3
e3
Length
3 mm
4.039 mm
Moisture Sensitivity Level
1
1
Number of Functions
1
1
Number of Terminals
16
16
Operating Temperature-Max
85 °C
125 °C
Operating Temperature-Min
-40 °C
Output Current-Max
0.68 A
0.68 A
Output Voltage-Nom
2.5 V
2.5 V
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
HVQCCN
HTSSOP
Package Equivalence Code
LCC16,.12SQ,20
TSSOP16,.19,20
Package Shape
SQUARE
RECTANGULAR
Package Style
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Cel)
260
260
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
0.8 mm
1.1 mm
Surface Mount
YES
YES
Switcher Configuration
BUCK-BOOST
BUCK-BOOST
Switching Frequency-Max
1400 kHz
1400 kHz
Technology
CMOS
CMOS
Temperature Grade
OTHER
AUTOMOTIVE
Terminal Finish
MATTE TIN
MATTE TIN
Terminal Form
NO LEAD
GULL WING
Terminal Pitch
0.5 mm
0.5 mm
Terminal Position
QUAD
DUAL
Time@Peak Reflow Temperature-Max (s)
30
30
Width
3 mm
3 mm
Base Number Matches
2
2