LTC2909CDDB-3.3#TRM
vs
LTC2909CDDB-3.3#TRPBF
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
LINEAR TECHNOLOGY CORP
LINEAR TECHNOLOGY CORP
Part Package Code
DFN
DFN
Package Description
HVSON,
3 X 2 MM, LEAD FREE, PLASTIC, MO-229WECD-1, DFN-8
Pin Count
8
8
Manufacturer Package Code
DDB
DDB
Reach Compliance Code
not_compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.39.00.01
8542.39.00.01
Adjustable Threshold
YES
YES
Analog IC - Other Type
BIPOLAR UNDER/OVERVOLTAGE SUPERVISOR
BIPOLAR UNDER/OVERVOLTAGE SUPERVISOR
JESD-30 Code
R-PDSO-N8
R-PDSO-N8
JESD-609 Code
e0
e3
Length
3 mm
3 mm
Moisture Sensitivity Level
1
1
Number of Channels
2
2
Number of Functions
3
3
Number of Terminals
8
8
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
HVSON
VSON
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
0.8 mm
0.8 mm
Supply Voltage-Min (Vsup)
0.5 V
0.5 V
Supply Voltage-Nom (Vsup)
3.3 V
3.3 V
Surface Mount
YES
YES
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Finish
TIN LEAD
Matte Tin (Sn)
Terminal Form
NO LEAD
NO LEAD
Terminal Pitch
0.5 mm
0.5 mm
Terminal Position
DUAL
DUAL
Width
2 mm
2 mm
Base Number Matches
2
2
Package Equivalence Code
SOLCC8,.08,20
Peak Reflow Temperature (Cel)
260
Supply Current-Max (Isup)
0.15 mA
Technology
CMOS
Time@Peak Reflow Temperature-Max (s)
30
Compare LTC2909CDDB-3.3#TRM with alternatives
Compare LTC2909CDDB-3.3#TRPBF with alternatives