LTC2909CDDB-3.3#TR
vs
LTC2909IDDB-3.3
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
LINEAR TECHNOLOGY CORP
LINEAR TECHNOLOGY CORP
Part Package Code
DFN
DFN
Package Description
3 X 2 MM, PLASTIC, MO-229WECD-1, DFN-8
3 X 2 MM, PLASTIC, MO-229WECD-1, DFN-8
Pin Count
8
8
Manufacturer Package Code
DDB
DDB
Reach Compliance Code
not_compliant
not_compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.39.00.01
8542.39.00.01
Adjustable Threshold
YES
YES
Analog IC - Other Type
BIPOLAR UNDER/OVERVOLTAGE SUPERVISOR
BIPOLAR UNDER/OVERVOLTAGE SUPERVISOR
JESD-30 Code
R-PDSO-N8
R-PDSO-N8
JESD-609 Code
e0
e0
Length
3 mm
3 mm
Moisture Sensitivity Level
1
1
Number of Channels
2
2
Number of Functions
3
3
Number of Terminals
8
8
Operating Temperature-Max
70 °C
85 °C
Operating Temperature-Min
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
HVSON
VSON
Package Equivalence Code
SOLCC8,.08,20
SOLCC8,.08,20
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
Peak Reflow Temperature (Cel)
235
235
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
0.8 mm
0.8 mm
Supply Current-Max (Isup)
0.15 mA
0.15 mA
Supply Voltage-Min (Vsup)
0.5 V
0.5 V
Supply Voltage-Nom (Vsup)
3.3 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
INDUSTRIAL
Terminal Finish
Tin/Lead (Sn/Pb)
Tin/Lead (Sn/Pb)
Terminal Form
NO LEAD
NO LEAD
Terminal Pitch
0.5 mm
0.5 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
20
20
Width
2 mm
2 mm
Base Number Matches
2
2
Compare LTC2909CDDB-3.3#TR with alternatives
Compare LTC2909IDDB-3.3 with alternatives