LTC2905IDDB#PBF
vs
LTC2905HDDB#TRMPBF
feature comparison
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Transferred
|
Transferred
|
Ihs Manufacturer |
LINEAR TECHNOLOGY CORP
|
LINEAR TECHNOLOGY CORP
|
Part Package Code |
DFN
|
DFN
|
Package Description |
VQCCN, SOLCC8,.08,20
|
3 X 2 MM, LEAD FREE, PLASTIC, M0-229WECD-1, DFN-8
|
Pin Count |
8
|
8
|
Manufacturer Package Code |
DDB
|
DDB
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Adjustable Threshold |
YES
|
YES
|
Analog IC - Other Type |
VOLTAGE SUPERVISOR
|
VOLTAGE SUPERVISOR
|
JESD-30 Code |
R-PQCC-N8
|
R-PDSO-N8
|
JESD-609 Code |
e3
|
e3
|
Length |
3 mm
|
3 mm
|
Moisture Sensitivity Level |
1
|
1
|
Number of Channels |
2
|
1
|
Number of Functions |
1
|
2
|
Number of Terminals |
8
|
8
|
Operating Temperature-Max |
85 °C
|
125 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
VQCCN
|
HVSON
|
Package Equivalence Code |
SOLCC8,.08,20
|
SOLCC8,.08,20
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
CHIP CARRIER, VERY THIN PROFILE
|
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
|
Peak Reflow Temperature (Cel) |
260
|
260
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
0.8 mm
|
0.8 mm
|
Supply Voltage-Min (Vsup) |
1 V
|
3.135 V
|
Supply Voltage-Nom (Vsup) |
1 V
|
1 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
AUTOMOTIVE
|
Terminal Finish |
Matte Tin (Sn)
|
Matte Tin (Sn)
|
Terminal Form |
NO LEAD
|
NO LEAD
|
Terminal Pitch |
0.5 mm
|
0.5 mm
|
Terminal Position |
QUAD
|
DUAL
|
Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
Width |
2 mm
|
2 mm
|
Base Number Matches |
2
|
2
|
Additional Feature |
|
ALSO OPERATES ON SUPPLY VOLTAGE 2.5V
|
Supply Voltage-Max (Vsup) |
|
3.465 V
|
|
|
|
Compare LTC2905IDDB#PBF with alternatives
Compare LTC2905HDDB#TRMPBF with alternatives