LTC2656CIUFD-L16#TRPBF
vs
LTC2656CCUFD-L16#TRPBF
feature comparison
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Transferred
|
Active
|
Ihs Manufacturer |
LINEAR TECHNOLOGY CORP
|
ANALOG DEVICES INC
|
Part Package Code |
QFN
|
|
Package Description |
4 X 5 MM, LEAD FREE, PLASTIC, MO-220, QFN-20
|
4 X 5 MM, LEAD FREE, PLASTIC, MO-220, QFN-20
|
Pin Count |
20
|
20
|
Manufacturer Package Code |
UFD
|
05-08-1711
|
Reach Compliance Code |
compliant
|
compliant
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Analog Output Voltage-Max |
2.5 V
|
2.5 V
|
Analog Output Voltage-Min |
|
|
Converter Type |
D/A CONVERTER
|
D/A CONVERTER
|
Input Bit Code |
BINARY
|
BINARY
|
Input Format |
SERIAL
|
SERIAL
|
JESD-30 Code |
R-PQCC-N20
|
R-PQCC-N20
|
JESD-609 Code |
e3
|
e3
|
Length |
5 mm
|
5 mm
|
Linearity Error-Max (EL) |
0.0183%
|
0.0183%
|
Moisture Sensitivity Level |
1
|
1
|
Number of Bits |
16
|
16
|
Number of Functions |
1
|
1
|
Number of Terminals |
20
|
20
|
Operating Temperature-Max |
85 °C
|
70 °C
|
Operating Temperature-Min |
-40 °C
|
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
HVQCCN
|
HVQCCN
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
Peak Reflow Temperature (Cel) |
260
|
260
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
0.8 mm
|
0.8 mm
|
Settling Time-Nom (tstl) |
8.9 µs
|
8.9 µs
|
Supply Voltage-Nom |
3 V
|
3 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
COMMERCIAL
|
Terminal Finish |
MATTE TIN
|
Matte Tin (Sn)
|
Terminal Form |
NO LEAD
|
NO LEAD
|
Terminal Pitch |
0.5 mm
|
0.5 mm
|
Terminal Position |
QUAD
|
QUAD
|
Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
Width |
4 mm
|
4 mm
|
Base Number Matches |
2
|
2
|
Pbfree Code |
|
No
|
ECCN Code |
|
EAR99
|
|
|
|
Compare LTC2656CIUFD-L16#TRPBF with alternatives
Compare LTC2656CCUFD-L16#TRPBF with alternatives