LTC2635CMSE-HZ8#PBF
vs
MCP4802-E/MS
feature comparison
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Transferred
|
Active
|
Ihs Manufacturer |
LINEAR TECHNOLOGY CORP
|
MICROCHIP TECHNOLOGY INC
|
Part Package Code |
MSOP
|
MSOP
|
Package Description |
LEAD FREE, PLASTIC, MSOP-10
|
PLASTIC, MSOP-8
|
Pin Count |
10
|
8
|
Manufacturer Package Code |
MSE
|
|
Reach Compliance Code |
compliant
|
compliant
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Analog Output Voltage-Max |
5.5 V
|
4.176 V
|
Analog Output Voltage-Min |
|
|
Converter Type |
D/A CONVERTER
|
D/A CONVERTER
|
Input Bit Code |
BINARY
|
BINARY
|
Input Format |
SERIAL
|
SERIAL
|
JESD-30 Code |
S-PDSO-G10
|
S-PDSO-G8
|
JESD-609 Code |
e3
|
e3
|
Length |
3 mm
|
3 mm
|
Linearity Error-Max (EL) |
0.1953%
|
0.39%
|
Moisture Sensitivity Level |
1
|
1
|
Number of Bits |
8
|
8
|
Number of Functions |
1
|
1
|
Number of Terminals |
10
|
8
|
Operating Temperature-Max |
70 °C
|
125 °C
|
Operating Temperature-Min |
|
-40 °C
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
HTSSOP
|
SOP
|
Package Equivalence Code |
TSSOP10,.19,20
|
SOP8,.19
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH
|
SMALL OUTLINE
|
Peak Reflow Temperature (Cel) |
260
|
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
1.1 mm
|
1.1 mm
|
Settling Time-Nom (tstl) |
3.9 µs
|
4.5 µs
|
Supply Current-Max |
0.9 mA
|
0.75 mA
|
Supply Voltage-Nom |
5 V
|
5 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
|
Temperature Grade |
COMMERCIAL
|
AUTOMOTIVE
|
Terminal Finish |
MATTE TIN
|
MATTE TIN
|
Terminal Form |
GULL WING
|
GULL WING
|
Terminal Pitch |
0.5 mm
|
0.65 mm
|
Terminal Position |
DUAL
|
DUAL
|
Time@Peak Reflow Temperature-Max (s) |
30
|
|
Width |
3 mm
|
3 mm
|
Base Number Matches |
2
|
1
|
Pbfree Code |
|
Yes
|
ECCN Code |
|
EAR99
|
Factory Lead Time |
|
5 Weeks
|
Samacsys Manufacturer |
|
Microchip
|
Screening Level |
|
TS 16949
|
|
|
|
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