LTC2604CGN#PBF
vs
LTC2604IGN#TRPBF
feature comparison
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Transferred
|
Transferred
|
Ihs Manufacturer |
LINEAR TECHNOLOGY CORP
|
LINEAR TECHNOLOGY CORP
|
Part Package Code |
SSOP
|
SSOP
|
Package Description |
0.150 INCH, LEAD FREE, PLASTIC, SSOP-16
|
0.150 INCH, LEAD FREE, PLASTIC, SSOP-16
|
Pin Count |
16
|
16
|
Manufacturer Package Code |
GN
|
GN
|
Reach Compliance Code |
compliant
|
compliant
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Converter Type |
D/A CONVERTER
|
D/A CONVERTER
|
Input Bit Code |
BINARY
|
BINARY
|
Input Format |
SERIAL
|
SERIAL
|
JESD-30 Code |
R-PDSO-G16
|
R-PDSO-G16
|
JESD-609 Code |
e3
|
e3
|
Length |
4.8895 mm
|
4.8895 mm
|
Linearity Error-Max (EL) |
0.0977%
|
0.0977%
|
Moisture Sensitivity Level |
1
|
1
|
Number of Bits |
16
|
16
|
Number of Functions |
4
|
4
|
Number of Terminals |
16
|
16
|
Operating Temperature-Max |
70 °C
|
85 °C
|
Operating Temperature-Min |
|
-40 °C
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
SSOP
|
SSOP
|
Package Equivalence Code |
SSOP16,.25
|
SSOP16,.25
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE, SHRINK PITCH
|
SMALL OUTLINE, SHRINK PITCH
|
Peak Reflow Temperature (Cel) |
260
|
260
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
1.75 mm
|
1.75 mm
|
Settling Time-Nom (tstl) |
10 µs
|
10 µs
|
Supply Current-Max |
2 mA
|
2 mA
|
Supply Voltage-Nom |
3 V
|
3 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
COMMERCIAL
|
INDUSTRIAL
|
Terminal Finish |
Matte Tin (Sn)
|
Matte Tin (Sn)
|
Terminal Form |
GULL WING
|
GULL WING
|
Terminal Pitch |
0.635 mm
|
0.635 mm
|
Terminal Position |
DUAL
|
DUAL
|
Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
Width |
3.899 mm
|
3.899 mm
|
Base Number Matches |
1
|
1
|
|
|
|
Compare LTC2604CGN#PBF with alternatives
Compare LTC2604IGN#TRPBF with alternatives