LTC2240IUP-10
vs
LTC2231CUP#TR
feature comparison
Rohs Code |
No
|
No
|
Part Life Cycle Code |
Obsolete
|
Transferred
|
Ihs Manufacturer |
ANALOG DEVICES INC
|
LINEAR TECHNOLOGY CORP
|
Package Description |
9 X 9 MM, PLASTIC, MO-220, QFN-64
|
HVQCCN, LCC64,.35SQ,20
|
Reach Compliance Code |
not_compliant
|
not_compliant
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Analog Input Voltage-Max |
1 V
|
1 V
|
Analog Input Voltage-Min |
-1 V
|
-1 V
|
Converter Type |
ADC, PROPRIETARY METHOD
|
ADC, PROPRIETARY METHOD
|
JESD-30 Code |
S-PQCC-N64
|
S-PQCC-N64
|
JESD-609 Code |
e0
|
e0
|
Length |
9 mm
|
9 mm
|
Linearity Error-Max (EL) |
0.0977%
|
0.0781%
|
Moisture Sensitivity Level |
1
|
1
|
Number of Analog In Channels |
1
|
1
|
Number of Bits |
10
|
10
|
Number of Functions |
1
|
1
|
Number of Terminals |
64
|
64
|
Operating Temperature-Max |
85 °C
|
70 °C
|
Operating Temperature-Min |
-40 °C
|
|
Output Bit Code |
OFFSET BINARY, 2'S COMPLEMENT BINARY
|
OFFSET BINARY, 2'S COMPLEMENT BINARY
|
Output Format |
PARALLEL, WORD
|
PARALLEL, WORD
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
HVQCCN
|
HVQCCN
|
Package Equivalence Code |
LCC64,.35SQ,20
|
LCC64,.35SQ,20
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Sample Rate |
170 MHz
|
135 MHz
|
Sample and Hold / Track and Hold |
SAMPLE
|
SAMPLE
|
Seated Height-Max |
0.8 mm
|
0.8 mm
|
Supply Voltage-Nom |
2.5 V
|
3.3 V
|
Surface Mount |
YES
|
YES
|
Temperature Grade |
INDUSTRIAL
|
COMMERCIAL
|
Terminal Finish |
Tin/Lead (Sn/Pb)
|
TIN LEAD
|
Terminal Form |
NO LEAD
|
NO LEAD
|
Terminal Pitch |
0.5 mm
|
0.5 mm
|
Terminal Position |
QUAD
|
QUAD
|
Width |
9 mm
|
9 mm
|
Base Number Matches |
2
|
2
|
Part Package Code |
|
QFN
|
Pin Count |
|
64
|
Manufacturer Package Code |
|
UP
|
Technology |
|
CMOS
|
|
|
|
Compare LTC2240IUP-10 with alternatives
Compare LTC2231CUP#TR with alternatives