LTC2188IUP#TRPBF vs LTC2188IUP#PBF feature comparison

LTC2188IUP#TRPBF Linear Technology

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LTC2188IUP#PBF Linear Technology

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Rohs Code Yes Yes
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer LINEAR TECHNOLOGY CORP LINEAR TECHNOLOGY CORP
Part Package Code QFN QFN
Package Description 9 X 9 MM, LEAD FREE, PLASTIC, MO-220WNJR-5, QFN-64 9 X 9 MM, LEAD FREE, PLASTIC, MO-220WNJR-5, QFN-64
Pin Count 64 64
Manufacturer Package Code UP UP
Reach Compliance Code compliant compliant
ECCN Code 3A991.C.4 3A991.C.4
HTS Code 8542.39.00.01 8542.39.00.01
Analog Input Voltage-Max 2 V 2 V
Analog Input Voltage-Min -2 V -2 V
Converter Type ADC, PROPRIETARY METHOD ADC, PROPRIETARY METHOD
JESD-30 Code S-PQCC-N64 S-PQCC-N64
JESD-609 Code e3 e3
Length 9 mm 9 mm
Linearity Error-Max (EL) 0.0099% 0.0099%
Moisture Sensitivity Level 1 1
Number of Analog In Channels 2 2
Number of Bits 16 16
Number of Functions 1 1
Number of Terminals 64 64
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Output Bit Code OFFSET BINARY, 2'S COMPLEMENT BINARY OFFSET BINARY, 2'S COMPLEMENT BINARY
Output Format PARALLEL, WORD PARALLEL, WORD
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code HVQCCN HVQCCN
Package Equivalence Code LCC64,.35SQ,20 LCC64,.35SQ,20
Package Shape SQUARE SQUARE
Package Style CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
Peak Reflow Temperature (Cel) 260 260
Qualification Status Not Qualified Not Qualified
Sample Rate 20 MHz 20 MHz
Sample and Hold / Track and Hold SAMPLE SAMPLE
Seated Height-Max 0.8 mm 0.8 mm
Supply Voltage-Nom 1.8 V 1.8 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish MATTE TIN MATTE TIN
Terminal Form NO LEAD NO LEAD
Terminal Pitch 0.5 mm 0.5 mm
Terminal Position QUAD QUAD
Time@Peak Reflow Temperature-Max (s) 30 30
Width 9 mm 9 mm
Base Number Matches 2 2

Compare LTC2188IUP#TRPBF with alternatives

Compare LTC2188IUP#PBF with alternatives