LTC2053CDD
vs
LTC2053CMS8#TRPBF
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
LINEAR TECHNOLOGY CORP
LINEAR TECHNOLOGY CORP
Part Package Code
DFN
MSOP
Package Description
3 X 3 MM, 0.80 MM HEIGHT, PLASTIC, DFN-8
LEAD FREE, PLASTIC, MSOP-8
Pin Count
8
8
Manufacturer Package Code
DD
MS8
Reach Compliance Code
not_compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.33.00.01
8542.33.00.01
Amplifier Type
INSTRUMENTATION AMPLIFIER
INSTRUMENTATION AMPLIFIER
Average Bias Current-Max (IIB)
0.01 µA
0.01 µA
Common-mode Reject Ratio-Min
105 dB
105 dB
Input Offset Current-Max (IIO)
0.003 µA
0.003 µA
Input Offset Voltage-Max
20 µV
20 µV
JESD-30 Code
S-PDSO-N8
S-PDSO-G8
JESD-609 Code
e0
e3
Length
3 mm
3 mm
Moisture Sensitivity Level
1
1
Neg Supply Voltage Limit-Max
-5.5 V
-5.5 V
Neg Supply Voltage-Nom (Vsup)
-5 V
-5 V
Non-linearity-Max
0.001%
0.001%
Number of Functions
1
1
Number of Terminals
8
8
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
VSON
TSSOP
Package Equivalence Code
SOLCC8,.11,20
TSSOP8,.19
Package Shape
SQUARE
SQUARE
Package Style
SMALL OUTLINE, VERY THIN PROFILE
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
0.8 mm
1.1 mm
Slew Rate-Nom
0.2 V/us
0.2 V/us
Supply Current-Max
1.3 mA
1.3 mA
Supply Voltage Limit-Max
5.5 V
5.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Finish
TIN LEAD
MATTE TIN
Terminal Form
NO LEAD
GULL WING
Terminal Pitch
0.5 mm
0.65 mm
Terminal Position
DUAL
DUAL
Width
3 mm
3 mm
Base Number Matches
2
2
Bandwidth (3dB)-Nom
0.2 MHz
Packing Method
TR
Peak Reflow Temperature (Cel)
260
Time@Peak Reflow Temperature-Max (s)
30
Compare LTC2053CDD with alternatives
Compare LTC2053CMS8#TRPBF with alternatives