LTC1592ACG#TR
vs
LTC2754AIUKG-16#TRPBF
feature comparison
| Rohs Code |
No
|
Yes
|
| Part Life Cycle Code |
Transferred
|
Transferred
|
| Ihs Manufacturer |
LINEAR TECHNOLOGY CORP
|
LINEAR TECHNOLOGY CORP
|
| Part Package Code |
SSOP
|
QFN
|
| Package Description |
SSOP,
|
7 X 8 MM, LEAD FREE, PLASTIC, QFN-52
|
| Pin Count |
16
|
52
|
| Manufacturer Package Code |
G
|
UKG
|
| Reach Compliance Code |
compliant
|
compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Analog Output Voltage-Max |
10 V
|
10 V
|
| Analog Output Voltage-Min |
-10 V
|
-10 V
|
| Converter Type |
D/A CONVERTER
|
D/A CONVERTER
|
| Input Bit Code |
BINARY
|
BINARY
|
| Input Format |
SERIAL
|
SERIAL
|
| JESD-30 Code |
R-PDSO-G16
|
R-PQCC-N52
|
| JESD-609 Code |
e0
|
e3
|
| Length |
6.2 mm
|
8 mm
|
| Linearity Error-Max (EL) |
0.0015%
|
0.0015%
|
| Moisture Sensitivity Level |
1
|
1
|
| Number of Bits |
16
|
16
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
16
|
52
|
| Operating Temperature-Max |
70 °C
|
85 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
SSOP
|
HVQCCN
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE, SHRINK PITCH
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
2 mm
|
0.8 mm
|
| Settling Time-Nom (tstl) |
2 µs
|
2 µs
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Temperature Grade |
COMMERCIAL
|
INDUSTRIAL
|
| Terminal Finish |
TIN LEAD
|
Matte Tin (Sn)
|
| Terminal Form |
GULL WING
|
NO LEAD
|
| Terminal Pitch |
0.65 mm
|
0.5 mm
|
| Terminal Position |
DUAL
|
QUAD
|
| Width |
5.3 mm
|
7 mm
|
| Base Number Matches |
2
|
2
|
| Package Equivalence Code |
|
LCC52,.27X.31,20
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Supply Current-Max |
|
0.001 mA
|
| Technology |
|
CMOS
|
| Time@Peak Reflow Temperature-Max (s) |
|
30
|
|
|
|
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