LTC1591-1CG
vs
LTC1591-1CN#PBF
feature comparison
| Rohs Code |
No
|
Yes
|
| Part Life Cycle Code |
Transferred
|
Obsolete
|
| Ihs Manufacturer |
LINEAR TECHNOLOGY CORP
|
LINEAR TECHNOLOGY CORP
|
| Part Package Code |
SSOP
|
DIP
|
| Package Description |
SSOP, SSOP28,.3
|
LEAD FREE, PLASTIC, DIP-28
|
| Pin Count |
28
|
28
|
| Manufacturer Package Code |
G
|
N
|
| Reach Compliance Code |
not_compliant
|
compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Analog Output Voltage-Max |
10 V
|
10 V
|
| Analog Output Voltage-Min |
-10 V
|
-10 V
|
| Converter Type |
D/A CONVERTER
|
D/A CONVERTER
|
| Input Bit Code |
BINARY
|
BINARY
|
| Input Format |
PARALLEL, WORD
|
PARALLEL, WORD
|
| JESD-30 Code |
R-PDSO-G28
|
R-PDIP-T28
|
| JESD-609 Code |
e0
|
e3
|
| Length |
10.2 mm
|
34.789 mm
|
| Linearity Error-Max (EL) |
0.0061%
|
0.0061%
|
| Moisture Sensitivity Level |
1
|
1
|
| Number of Bits |
14
|
14
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
28
|
28
|
| Operating Temperature-Max |
70 °C
|
70 °C
|
| Operating Temperature-Min |
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
SSOP
|
DIP
|
| Package Equivalence Code |
SSOP28,.3
|
DIP28,.3
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE, SHRINK PITCH
|
IN-LINE
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
2 mm
|
3.937 mm
|
| Settling Time-Nom (tstl) |
1 µs
|
1 µs
|
| Supply Current-Max |
0.01 mA
|
0.01 mA
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
YES
|
NO
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
| Terminal Finish |
TIN LEAD
|
MATTE TIN
|
| Terminal Form |
GULL WING
|
THROUGH-HOLE
|
| Terminal Pitch |
0.65 mm
|
2.54 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Width |
5.3 mm
|
7.62 mm
|
| Base Number Matches |
2
|
1
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Time@Peak Reflow Temperature-Max (s) |
|
30
|
|
|
|
Compare LTC1591-1CG with alternatives
Compare LTC1591-1CN#PBF with alternatives