LT6700MPDCB-3#TRPBF
vs
LT6700MPDCB-2#PBF
feature comparison
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Transferred
|
Obsolete
|
Ihs Manufacturer |
LINEAR TECHNOLOGY CORP
|
ANALOG DEVICES INC
|
Part Package Code |
DFN
|
|
Package Description |
2 X 3 MM, LEAD FREE, PLASTIC, MO-229, DFN-6
|
HVSON,
|
Pin Count |
6
|
6
|
Manufacturer Package Code |
DCB
|
05-08-1715
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
EAR99
|
|
HTS Code |
8542.39.00.01
|
|
Amplifier Type |
COMPARATOR
|
COMPARATOR
|
Average Bias Current-Max (IIB) |
0.05 µA
|
0.05 µA
|
Bias Current-Max (IIB) @25C |
0.05 µA
|
|
JESD-30 Code |
R-PDSO-N6
|
R-PDSO-N6
|
JESD-609 Code |
e3
|
e3
|
Length |
3 mm
|
3 mm
|
Moisture Sensitivity Level |
1
|
1
|
Number of Functions |
2
|
2
|
Number of Terminals |
6
|
6
|
Operating Temperature-Max |
125 °C
|
125 °C
|
Operating Temperature-Min |
-55 °C
|
-55 °C
|
Output Type |
OPEN-COLLECTOR
|
OPEN-COLLECTOR
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
HVSON
|
HVSON
|
Package Equivalence Code |
SOLCC6,.12,20
|
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
|
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
|
Packing Method |
TR
|
|
Peak Reflow Temperature (Cel) |
260
|
260
|
Qualification Status |
Not Qualified
|
|
Response Time-Nom |
29000 ns
|
29000 ns
|
Seated Height-Max |
0.8 mm
|
0.8 mm
|
Supply Current-Max |
0.019 mA
|
|
Supply Voltage Limit-Max |
18.5 V
|
18.5 V
|
Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
Surface Mount |
YES
|
YES
|
Technology |
BIPOLAR
|
BIPOLAR
|
Temperature Grade |
MILITARY
|
MILITARY
|
Terminal Finish |
MATTE TIN
|
Matte Tin (Sn) - annealed
|
Terminal Form |
NO LEAD
|
NO LEAD
|
Terminal Pitch |
0.5 mm
|
0.5 mm
|
Terminal Position |
DUAL
|
DUAL
|
Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
Width |
2 mm
|
2 mm
|
Base Number Matches |
2
|
2
|
Pbfree Code |
|
No
|
|
|
|
Compare LT6700MPDCB-3#TRPBF with alternatives
Compare LT6700MPDCB-2#PBF with alternatives