LT1846J
vs
SG1846F-DESC
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Obsolete
|
Active
|
| Ihs Manufacturer |
LINEAR TECHNOLOGY CORP
|
MICROCHIP TECHNOLOGY INC
|
| Part Package Code |
DIP
|
|
| Package Description |
DIP, DIP16,.3
|
|
| Pin Count |
16
|
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
|
| HTS Code |
8542.39.00.01
|
|
| Analog IC - Other Type |
SWITCHING CONTROLLER
|
SWITCHING CONTROLLER
|
| Control Mode |
CURRENT-MODE
|
CURRENT-MODE
|
| Control Technique |
PULSE WIDTH MODULATION
|
PULSE WIDTH MODULATION
|
| Input Voltage-Max |
40 V
|
40 V
|
| Input Voltage-Min |
7.25 V
|
8 V
|
| Input Voltage-Nom |
8 V
|
15 V
|
| JESD-30 Code |
R-CDIP-T16
|
R-CDFP-F16
|
| JESD-609 Code |
e0
|
e0
|
| Length |
19.43 mm
|
|
| Moisture Sensitivity Level |
1
|
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
16
|
16
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-55 °C
|
-55 °C
|
| Output Current-Max |
0.5 A
|
0.5 A
|
| Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
CERAMIC, GLASS-SEALED
|
| Package Code |
DIP
|
DFP
|
| Package Equivalence Code |
DIP16,.3
|
FL16(UNSPEC)
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
FLATPACK
|
| Qualification Status |
Not Qualified
|
|
| Seated Height-Max |
5.08 mm
|
|
| Supply Current-Max (Isup) |
21 mA
|
21 mA
|
| Surface Mount |
NO
|
YES
|
| Switcher Configuration |
PUSH-PULL
|
BUCK-BOOST
|
| Switching Frequency-Max |
47 kHz
|
500 kHz
|
| Technology |
BIPOLAR
|
|
| Temperature Grade |
MILITARY
|
MILITARY
|
| Terminal Finish |
TIN LEAD
|
Tin/Lead (Sn/Pb)
|
| Terminal Form |
THROUGH-HOLE
|
FLAT
|
| Terminal Pitch |
2.54 mm
|
|
| Terminal Position |
DUAL
|
DUAL
|
| Width |
7.62 mm
|
|
| Base Number Matches |
2
|
1
|
| Supply Voltage-Nom (Vsup) |
|
15 V
|
|
|
|
Compare LT1846J with alternatives
Compare SG1846F-DESC with alternatives