LT1218LCN8
vs
MCP606-I/P
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
LINEAR TECHNOLOGY CORP
TELCOM SEMICONDUCTOR INC
Part Package Code
DIP
Package Description
DIP, DIP8,.3
PLASTIC, DIP-8
Pin Count
8
Manufacturer Package Code
N
Reach Compliance Code
not_compliant
unknown
ECCN Code
EAR99
HTS Code
8542.33.00.01
Amplifier Type
OPERATIONAL AMPLIFIER
OPERATIONAL AMPLIFIER
Architecture
VOLTAGE-FEEDBACK
Average Bias Current-Max (IIB)
0.075 µA
Bias Current-Max (IIB) @25C
0.075 µA
Common-mode Reject Ratio-Nom
110 dB
91 dB
Frequency Compensation
YES
Input Offset Voltage-Max
250 µV
250 µV
JESD-30 Code
R-PDIP-T8
R-PDIP-T8
JESD-609 Code
e0
Low-Offset
YES
Micropower
YES
Moisture Sensitivity Level
1
Neg Supply Voltage-Nom (Vsup)
-5 V
Number of Functions
1
1
Number of Terminals
8
8
Operating Temperature-Max
70 °C
85 °C
Operating Temperature-Min
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
DIP
Package Equivalence Code
DIP8,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
3.937 mm
Slew Rate-Min
0.06 V/us
Slew Rate-Nom
0.1 V/us
0.08 V/us
Supply Current-Max
0.495 mA
Supply Voltage Limit-Max
8 V
7 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
BIPOLAR
CMOS
Temperature Grade
COMMERCIAL
INDUSTRIAL
Terminal Finish
TIN LEAD
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
Terminal Position
DUAL
DUAL
Unity Gain BW-Nom
300
155
Voltage Gain-Min
150000
Width
7.62 mm
Base Number Matches
2
2
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