LT1077CN8#PBF vs MCP608I/P feature comparison

LT1077CN8#PBF Linear Technology

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MCP608I/P Microchip Technology Inc

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Rohs Code Yes Yes
Part Life Cycle Code Transferred Active
Ihs Manufacturer LINEAR TECHNOLOGY CORP MICROCHIP TECHNOLOGY INC
Part Package Code DIP DIP
Package Description 0.300 INCH, PLASTIC, DIP-8 DIP,
Pin Count 8 8
Manufacturer Package Code N
Reach Compliance Code compliant compliant
ECCN Code EAR99
HTS Code 8542.33.00.01
Amplifier Type OPERATIONAL AMPLIFIER OPERATIONAL AMPLIFIER
Architecture VOLTAGE-FEEDBACK
Average Bias Current-Max (IIB) 0.012 µA 0.00008 µA
Bias Current-Max (IIB) @25C 0.011 µA
Common-mode Reject Ratio-Min 94 dB
Common-mode Reject Ratio-Nom 107 dB 91 dB
Frequency Compensation YES
Input Offset Voltage-Max 320 µV 250 µV
JESD-30 Code R-PDIP-T8 R-PDIP-T8
JESD-609 Code e3 e3
Length 9.78 mm 9.27 mm
Low-Offset YES
Micropower YES
Moisture Sensitivity Level 1
Neg Supply Voltage Limit-Max -22 V
Neg Supply Voltage-Nom (Vsup) -15 V
Number of Functions 1 1
Number of Terminals 8 8
Operating Temperature-Max 70 °C 85 °C
Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP DIP
Package Equivalence Code DIP8,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Peak Reflow Temperature (Cel) 260 NOT SPECIFIED
Qualification Status Not Qualified Not Qualified
Seated Height-Max 4.445 mm 5.33 mm
Slew Rate-Min 0.05 V/us
Slew Rate-Nom 0.12 V/us 0.08 V/us
Supply Current-Max 0.095 mA
Supply Voltage Limit-Max 22 V 7 V
Supply Voltage-Nom (Vsup) 15 V 5 V
Surface Mount NO NO
Technology BIPOLAR CMOS
Temperature Grade COMMERCIAL INDUSTRIAL
Terminal Finish MATTE TIN MATTE TIN
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30 NOT SPECIFIED
Unity Gain BW-Nom 250 155
Voltage Gain-Min 200000
Width 7.62 mm 7.62 mm
Base Number Matches 1 2
Pbfree Code Yes

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