LSP1002-454-2
vs
HSMP-3814
feature comparison
Rohs Code |
Yes
|
No
|
Part Life Cycle Code |
Active
|
Transferred
|
Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
AGILENT TECHNOLOGIES INC
|
Package Description |
R-PDSO-N3
|
|
Reach Compliance Code |
compliant
|
unknown
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8541.10.00.80
|
8541.10.00.80
|
Additional Feature |
LOW DISTORTION
|
LOW DISTORTION
|
Application |
ATTENUATOR
|
ATTENUATOR
|
Breakdown Voltage-Min |
100 V
|
100 V
|
Configuration |
SERIES CONNECTED, CENTER TAP, 2 ELEMENTS
|
COMMON CATHODE, 2 ELEMENTS
|
Diode Capacitance-Max |
0.32 pF
|
0.35 pF
|
Diode Element Material |
SILICON
|
SILICON
|
Diode Forward Resistance-Max |
4 Ω
|
4 Ω
|
Diode Res Test Current |
100 mA
|
100 mA
|
Diode Res Test Frequency |
100 MHz
|
100 MHz
|
Diode Type |
PIN DIODE
|
PIN DIODE
|
Frequency Band |
VERY HIGH FREQUENCY TO C BAND
|
|
JESD-30 Code |
R-PDSO-N3
|
R-PDSO-G3
|
Minority Carrier Lifetime-Nom |
1.5 µs
|
1.5 µs
|
Number of Elements |
2
|
2
|
Number of Terminals |
3
|
3
|
Operating Temperature-Max |
125 °C
|
150 °C
|
Operating Temperature-Min |
-65 °C
|
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE
|
SMALL OUTLINE
|
Power Dissipation-Max |
0.5 W
|
0.25 W
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Reverse Test Voltage |
50 V
|
50 V
|
Surface Mount |
YES
|
YES
|
Technology |
POSITIVE-INTRINSIC-NEGATIVE
|
POSITIVE-INTRINSIC-NEGATIVE
|
Terminal Form |
NO LEAD
|
GULL WING
|
Terminal Position |
DUAL
|
DUAL
|
Base Number Matches |
1
|
20
|
Diode Capacitance-Nom |
|
0.35 pF
|
JESD-609 Code |
|
e0
|
Terminal Finish |
|
TIN LEAD
|
|
|
|
Compare LSP1002-454-2 with alternatives
Compare HSMP-3814 with alternatives