LSP1002-454-0
vs
LSP1002-454-1
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROCHIP TECHNOLOGY INC
|
| Package Description |
R-PDSO-N3
|
R-PDSO-N3
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8541.10.00.80
|
8541.10.00.80
|
| Additional Feature |
LOW DISTORTION
|
LOW DISTORTION
|
| Application |
ATTENUATOR
|
ATTENUATOR
|
| Breakdown Voltage-Min |
100 V
|
100 V
|
| Configuration |
SINGLE
|
SINGLE
|
| Diode Capacitance-Max |
0.32 pF
|
0.32 pF
|
| Diode Element Material |
SILICON
|
SILICON
|
| Diode Forward Resistance-Max |
4 Ω
|
4 Ω
|
| Diode Res Test Current |
100 mA
|
100 mA
|
| Diode Res Test Frequency |
100 MHz
|
100 MHz
|
| Diode Type |
PIN DIODE
|
PIN DIODE
|
| Frequency Band |
VERY HIGH FREQUENCY TO C BAND
|
VERY HIGH FREQUENCY TO C BAND
|
| JESD-30 Code |
R-PDSO-N3
|
R-PDSO-N3
|
| Minority Carrier Lifetime-Nom |
1.5 µs
|
1.5 µs
|
| Number of Elements |
1
|
1
|
| Number of Terminals |
3
|
3
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-65 °C
|
-65 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
SMALL OUTLINE
|
| Power Dissipation-Max |
0.5 W
|
0.5 W
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Reverse Test Voltage |
50 V
|
50 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
POSITIVE-INTRINSIC-NEGATIVE
|
POSITIVE-INTRINSIC-NEGATIVE
|
| Terminal Form |
NO LEAD
|
NO LEAD
|
| Terminal Position |
DUAL
|
DUAL
|
| Base Number Matches |
2
|
2
|
|
|
|
Compare LSP1002-454-0 with alternatives
Compare LSP1002-454-1 with alternatives