LS103B-TP
vs
SD103BW
feature comparison
Pbfree Code |
Yes
|
|
Rohs Code |
Yes
|
|
Part Life Cycle Code |
Obsolete
|
Active
|
Ihs Manufacturer |
MICRO COMMERCIAL COMPONENTS
|
TAK CHEONG ELECTRONICS HOLDINGS CO LTD
|
Part Package Code |
MELF
|
|
Package Description |
ROHS COMPLIANT, PLASTIC, QUADROMELF-2
|
GREEN, PLASTIC PACKAGE-2
|
Pin Count |
2
|
2
|
Reach Compliance Code |
unknown
|
compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8541.10.00.70
|
8541.10.00.70
|
Additional Feature |
HIGH RELIABILITY
|
|
Application |
GENERAL PURPOSE
|
|
Case Connection |
ISOLATED
|
|
Configuration |
SINGLE
|
SINGLE
|
Diode Element Material |
SILICON
|
SILICON
|
Diode Type |
RECTIFIER DIODE
|
RECTIFIER DIODE
|
JESD-30 Code |
O-PELF-R2
|
R-PDSO-F2
|
JESD-609 Code |
e3
|
e3
|
Moisture Sensitivity Level |
1
|
|
Number of Elements |
1
|
1
|
Number of Phases |
1
|
1
|
Number of Terminals |
2
|
2
|
Output Current-Max |
0.35 A
|
0.2 A
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Shape |
ROUND
|
RECTANGULAR
|
Package Style |
LONG FORM
|
SMALL OUTLINE
|
Peak Reflow Temperature (Cel) |
260
|
|
Power Dissipation-Max |
0.4 W
|
0.4 W
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Rep Pk Reverse Voltage-Max |
30 V
|
30 V
|
Reverse Recovery Time-Max |
0.01 µs
|
|
Surface Mount |
YES
|
YES
|
Technology |
SCHOTTKY
|
SCHOTTKY
|
Terminal Finish |
Matte Tin (Sn)
|
MATTE TIN
|
Terminal Form |
WRAP AROUND
|
FLAT
|
Terminal Position |
END
|
DUAL
|
Time@Peak Reflow Temperature-Max (s) |
10
|
|
Base Number Matches |
1
|
4
|
Operating Temperature-Max |
|
175 °C
|
|
|
|
Compare LS103B-TP with alternatives
Compare SD103BW with alternatives