Findchips: Compare LRS1382 vs LRS1386

LRS1382 vs LRS1386 feature comparison

Buy Now Datasheet

Buy Now Datasheet

Part Life Cycle Code	Obsolete	Obsolete
Ihs Manufacturer	SHARP CORP	SHARP CORP
Package Description	8 X 11 MM, PLASTIC, CSP-72	8 X 11 MM, PLASTIC, CSP-72
Reach Compliance Code	unknown	unknown
ECCN Code	EAR99	EAR99
HTS Code	8542.32.00.71	8542.32.00.71
Additional Feature	CONTAINS 512K X 16 BITS SRAM	CONTAINS 512K X 16 BITS SRAM
JESD-30 Code	R-PBGA-B72	R-PBGA-B72
Length	11 mm	11 mm
Memory Density	33554432 bit	67108864 bit
Memory IC Type	MEMORY CIRCUIT	MEMORY CIRCUIT
Memory Width	16	16
Number of Functions	1	1
Number of Terminals	72	72
Number of Words	2097152 words	4194304 words
Number of Words Code	2000000	4000000
Operating Mode	ASYNCHRONOUS	ASYNCHRONOUS
Operating Temperature-Max	85 °C	85 °C
Operating Temperature-Min	-25 °C	-25 °C
Organization	2MX16	4MX16
Package Body Material	PLASTIC/EPOXY	PLASTIC/EPOXY
Package Code	LFBGA	LFBGA
Package Shape	RECTANGULAR	RECTANGULAR
Package Style	GRID ARRAY, LOW PROFILE, FINE PITCH	GRID ARRAY, LOW PROFILE, FINE PITCH
Qualification Status	Not Qualified	Not Qualified
Seated Height-Max	1.4 mm	1.4 mm
Supply Voltage-Max (Vsup)	3.3 V	3.3 V
Supply Voltage-Min (Vsup)	2.7 V	2.7 V
Supply Voltage-Nom (Vsup)	3 V	3 V
Surface Mount	YES	YES
Technology	CMOS	CMOS
Temperature Grade	OTHER	OTHER
Terminal Form	BALL	BALL
Terminal Pitch	0.8 mm	0.8 mm
Terminal Position	BOTTOM	BOTTOM
Width	8 mm	8 mm
Base Number Matches	1	1
	Memory » Other Memory ICs	Memory » Other Memory ICs