LPV324MT vs LMV324MTX feature comparison

LPV324MT National Semiconductor Corporation

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LMV324MTX Rochester Electronics LLC

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Rohs Code No No
Part Life Cycle Code Transferred Active
Ihs Manufacturer NATIONAL SEMICONDUCTOR CORP ROCHESTER ELECTRONICS LLC
Part Package Code TSSOP TSSOP
Package Description TSSOP-14 TSSOP-14
Pin Count 14 14
Reach Compliance Code not_compliant unknown
ECCN Code EAR99
HTS Code 8542.33.00.01
Amplifier Type OPERATIONAL AMPLIFIER OPERATIONAL AMPLIFIER
Architecture VOLTAGE-FEEDBACK
Average Bias Current-Max (IIB) 0.06 µA 0.5 µA
Bias Current-Max (IIB) @25C 0.05 µA
Common-mode Reject Ratio-Nom 71 dB 65 dB
Frequency Compensation YES
Input Offset Voltage-Max 10000 µV 9000 µV
JESD-30 Code R-PDSO-G14 R-PDSO-G14
JESD-609 Code e0 e0
Length 5 mm 5 mm
Low-Bias NO
Low-Offset NO
Micropower YES
Moisture Sensitivity Level 1 1
Number of Functions 4 4
Number of Terminals 14 14
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSSOP TSSOP
Package Equivalence Code TSSOP14,.25
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Packing Method RAIL
Peak Reflow Temperature (Cel) 260 260
Power NO
Programmable Power NO
Qualification Status Not Qualified
Seated Height-Max 1.1 mm 1.1 mm
Slew Rate-Nom 0.1 V/us 1 V/us
Supply Current-Max 0.046 mA
Supply Voltage Limit-Max 5.5 V 5.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology BICMOS BICMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish Tin/Lead (Sn/Pb) TIN LEAD
Terminal Form GULL WING GULL WING
Terminal Pitch 0.65 mm 0.65 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 40 40
Unity Gain BW-Nom 152 1000
Voltage Gain-Min 10000
Wideband NO
Width 4.4 mm 4.4 mm
Base Number Matches 2 3
Pbfree Code Yes
Neg Supply Voltage Limit-Max
Neg Supply Voltage-Nom (Vsup)

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