LPC47M182-NR
vs
LPC47M172-NW
feature comparison
| Rohs Code |
No
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Active
|
| Ihs Manufacturer |
STANDARD MICROSYSTEMS CORP
|
MICROCHIP TECHNOLOGY INC
|
| Part Package Code |
QFP
|
|
| Package Description |
14 X 20 MM, 2.70 MM HEIGHT, QFP-128
|
14 X 20 MM, 2.70 MM HEIGHT, ROHS COMPLIANT, MQFP-128
|
| Pin Count |
128
|
|
| Reach Compliance Code |
compliant
|
compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Address Bus Width |
4
|
4
|
| Boundary Scan |
NO
|
NO
|
| Bus Compatibility |
LPC
|
PC-XT; PC-AT; PS/2; LPC
|
| Clock Frequency-Max |
14.318 MHz
|
14.318 MHz
|
| External Data Bus Width |
4
|
4
|
| JESD-30 Code |
R-PQFP-G128
|
R-PQFP-G128
|
| JESD-609 Code |
e0
|
|
| Length |
20 mm
|
20 mm
|
| Moisture Sensitivity Level |
3
|
|
| Number of I/O Lines |
21
|
21
|
| Number of Terminals |
128
|
128
|
| Operating Temperature-Max |
70 °C
|
70 °C
|
| Operating Temperature-Min |
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
FQFP
|
FQFP
|
| Package Equivalence Code |
QFP128,.67X.93,20
|
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
FLATPACK, FINE PITCH
|
FLATPACK, FINE PITCH
|
| Peak Reflow Temperature (Cel) |
235
|
NOT SPECIFIED
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
3.4 mm
|
3.4 mm
|
| Supply Current-Max |
15 mA
|
|
| Supply Voltage-Max |
3.6 V
|
3.63 V
|
| Supply Voltage-Min |
3 V
|
2.97 V
|
| Supply Voltage-Nom |
3.3 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
| Terminal Finish |
TIN LEAD
|
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.5 mm
|
0.5 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Width |
14 mm
|
14 mm
|
| Base Number Matches |
1
|
1
|
| Samacsys Manufacturer |
|
Microchip
|
| RAM (words) |
|
256
|
| Time@Peak Reflow Temperature-Max (s) |
|
NOT SPECIFIED
|
|
|
|
Compare LPC47M182-NR with alternatives
Compare LPC47M172-NW with alternatives