LPC3180FEL320 vs LPC3180FEL320/01,5 feature comparison

LPC3180FEL320 NXP Semiconductors

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LPC3180FEL320/01,5 NXP Semiconductors

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Rohs Code Yes Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS NXP SEMICONDUCTORS
Part Package Code BGA BGA
Package Description 13 X 13 MM, 0.90 MM HEIGHT, PLASTIC, SOT-824-1, LFBGA-320 13 X 13 MM, 0.90 MM HEIGHT, PLASTIC, SOT-824-1, LFBGA-320
Pin Count 320 320
Manufacturer Package Code SOT-824-1 SOT824-1
Reach Compliance Code unknown compliant
HTS Code 8542.31.00.01 8542.31.00.01
Has ADC YES YES
Additional Feature ALSO REQUIRES 1.8V OR 3.3V SUPPLY ALSO REQUIRES 1.8V OR 3.3V SUPPLY
Address Bus Width
Bit Size 32 32
Clock Frequency-Max 20 MHz 20 MHz
DAC Channels NO NO
DMA Channels YES YES
External Data Bus Width
JESD-30 Code S-PBGA-B320 S-PBGA-B320
JESD-609 Code e1
Length 13 mm 13 mm
Moisture Sensitivity Level 3 3
Number of I/O Lines 55 55
Number of Terminals 320 320
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
PWM Channels YES YES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LFBGA LFBGA
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, LOW PROFILE, FINE PITCH GRID ARRAY, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Cel) NOT SPECIFIED 260
Qualification Status Not Qualified Not Qualified
ROM Programmability FLASH FLASH
Seated Height-Max 1.3 mm 1.3 mm
Speed 208 MHz 208 MHz
Supply Voltage-Max 1.3 V 1.3 V
Supply Voltage-Min 1.1 V 1.1 V
Supply Voltage-Nom 1.2 V 1.2 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form BALL BALL
Terminal Pitch 0.5 mm 0.5 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 13 mm 13 mm
uPs/uCs/Peripheral ICs Type MICROCONTROLLER, RISC MICROCONTROLLER, RISC
Base Number Matches 2 1
ECCN Code EAR99
Samacsys Manufacturer NXP

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Compare LPC3180FEL320/01,5 with alternatives