LPC2364FET100
vs
LPC2364HBD100,551
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Not Recommended
Not Recommended
Ihs Manufacturer
NXP SEMICONDUCTORS
NXP SEMICONDUCTORS
Part Package Code
BGA
QFP
Package Description
9 X 9 MM, 0.70 MM HEIGHT, PLASTIC, SOT926-1, TFBGA-100
Pin Count
100
100
Manufacturer Package Code
SOT-926-1
SOT407-1
Reach Compliance Code
compliant
compliant
ECCN Code
3A991.A.2
3A991.A.2
HTS Code
8542.31.00.01
8542.31.00.01
Has ADC
YES
YES
Address Bus Width
Bit Size
32
32
CPU Family
ARM7
ARM7
Clock Frequency-Max
25 MHz
25 MHz
DAC Channels
YES
YES
DMA Channels
YES
YES
External Data Bus Width
16
JESD-30 Code
S-PBGA-B100
S-PQFP-G100
JESD-609 Code
e1
e3
Length
9 mm
14 mm
Moisture Sensitivity Level
3
3
Number of I/O Lines
70
70
Number of Terminals
100
100
On Chip Program ROM Width
8
8
Operating Temperature-Max
85 °C
125 °C
Operating Temperature-Min
-40 °C
-40 °C
PWM Channels
YES
YES
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TFBGA
QFP
Package Equivalence Code
BGA100,10X10,32
QFP100,.63SQ,20
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY, THIN PROFILE, FINE PITCH
FLATPACK
Peak Reflow Temperature (Cel)
260
260
Qualification Status
Not Qualified
Not Qualified
RAM (bytes)
34816
34816
ROM (words)
131072
131072
ROM Programmability
FLASH
FLASH
Seated Height-Max
1.2 mm
Speed
72 MHz
72 MHz
Supply Current-Max
100 mA
Supply Voltage-Max
3.6 V
3.6 V
Supply Voltage-Min
3.3 V
3 V
Supply Voltage-Nom
3.3 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
AUTOMOTIVE
Terminal Finish
TIN SILVER COPPER
Tin (Sn)
Terminal Form
BALL
GULL WING
Terminal Pitch
0.8 mm
0.5 mm
Terminal Position
BOTTOM
QUAD
Time@Peak Reflow Temperature-Max (s)
30
30
Width
9 mm
14 mm
uPs/uCs/Peripheral ICs Type
MICROCONTROLLER, RISC
MICROCONTROLLER, RISC
Base Number Matches
4
1
Factory Lead Time
13 Weeks
Samacsys Manufacturer
NXP
Boundary Scan
YES
Compare LPC2364FET100 with alternatives
Compare LPC2364HBD100,551 with alternatives